EV Group Engineered substrates Power electronics

EVG Sees Power Device and RF Applications Driving Demand for Wafer Bonding Solutions for Engineered Substrates
Dec 21, 2015
EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...

Tags: EV Group Engineered substrates Power electronics