IC packaging articles & resources on Made-in-China.com

UTAC, Sarda and AT&S Collaborate on Small, Fast GaAs-Based Voltage Regulators to Improve Data-Center Energy Efficiency

Jun 15, 2016

At the International Symposium on 3D Power Electronics, Integration and Manufacturing Symposium in Raleigh, NC, USA (13-15 June), power management component supplier Sarda Technologies of Durham, NC, USA announced a collaboration to ...

Tags: Power management, integrated circuits, 3D SiP

Cadence Offers IC Design Solutions For Fan-out Wafer-Level Chip Scale Packaging

Mar 16, 2016

Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. Designed to accelerate the multi-chip integration for ...

Tags: Cadence Design system, IC, Packaging

Tsinghua Unigroup of China to Buy 25% Stake in Two More Taiwanese Chip Assemblers--Such Acquisitions Seen to Bring Ample Capital Without Management Takeover

Dec 21, 2015

Tsinghua Unigroup of mainland China announced on Dec. 11 to acquire a 24.9 percent holding in Siliconware Precision Industries Co., Ltd. (SPIL) and a 25 percent stake in ChipMOS Technologies (Bermuda) Ltd. for total cost of NT$68.8 billion ...

Tags: Tsinghua Unigroup, semiconductor, Processing Machinery

New TSMC Fab to Target Orders for Driver ICs

Dec 13, 2015

Taiwan Semiconductor Manufacturing Company's (TSMC) planned 12-inch wafer fab in China could be vying for 16nm chip orders from China's local IC design houses specializing in the development of LCD driver ICs, touchscreen controllers, TDDI ...

Tags: IC industry, LCD driver

Solvay's Innovative Polymers Materials Cuts Cost in Semiconductor and Optoelectronic Industry

Oct 14, 2015

From the exterior plastic smartphone case, wearable device wrist bands, semiconductors IC packaging, specialty material for crucial optoelectronic components to aeronautics and military applications, there are several large chemical ...

Tags: Solvay, Specialty Polymers Materials

Taiwan Makers Increase Capital Despite Challenges

Sep 19, 2015

Four Taiwanese manufacturers have announced to increase capital to fund their expansion plans in the Taichung Export Processing Zone in central Taiwan and Chiayi Dapumei Intelligent Industrial Park in southern Taiwan. The four companies ...

Tags: IC packaging, single-lens camera, camera

Niching 2014 Profits Set a Record in 3-Year

Apr 1, 2015

IC packaging material and tool distributor Niching Industrial has posted net profits of NT$61.37 million (US$1.96 million) in 2014, up 116% on year and hitting a 3-year high. The earnings translated into a net EPS of NT$1.57. Niching ...

Tags: IC packaging, packaging material, tool distributor

Demand for High-End Packaging to Stay Strong in Q4

Nov 10, 2014

Semiconductor materials suppliers expect demand for high-end packaging to remain strong and buoy their sales in the fourth quarter of 2014. Ampoc Fareast and Niching Industrial have both indicated clear order visibility through the end of ...

Tags: Semiconductor, Packaging

Niching Industrial Looks to Ramp up Its Shipments of EMC-Based LED Leadframes

Sep 4, 2014

IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue growth in 2015. Niching's LED products lines are ...

Tags: IC packaging, packaging material

The Mobile Market Is Driving The Move to Novel Transistor Architectures

Apr 24, 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing. To assess these uncertainties and provide the latest ...

Tags: 3D Transistors, Electronics

Capital Equipment Investment Will See Some Pickup in The Second Half of 2013

Apr 12, 2013

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia. These trends will be explored at ...

Tags: Electrical, Electronics, semiconductor

Opportunities for Materials Innovation Are Providing

Jan 23, 2013

LEDs are “going mainstream but are still not yet a mature commodity”, according to market analyst Yole Développement in its latest ‘LED Packaging’ report. The analyst determines that the combination of growth ...

Tags: LEDs, LED package, LED Package Costs

Cutting LED Packaging Cost Drives New Designs Optimistic Forecast for 2013 Published

Jan 23, 2013

Cutting LED packaging cost drives new designs 22 Jan 2013 Optimistic sector forecast for 2013 published. LEDs are “going mainstream but are still not yet a mature commodity”, according to market analyst Yole ...

Tags: LED packaging, LED, LED packaging cost

Yole Développement Announces Its New Report "LED Packaging"

Jan 16, 2013

Yole Développement announces its new report “LED packaging”. Compared to the last edition, this update version provides you an update of all market metrics (packaged LED, equipment, materials…), an highlight of 2012 ...

Tags: Yole Développement, LED packaging, LED

Photonics Recognized as a Center Attracted a Mix of Industry Leaders

Jan 4, 2013

Organizers of Invest in Photonics 2012, a two-day international convention on photonics venture capital (VC) investment, said that participation at last month’s event increased “despite a tough investment decade in ...

Tags: Photonics, photonics venture capital, investment, lighting

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