Industrial Applications articles & resources on Made-in-China.com

Integreat Project Yields New Approaches to LED Production

Jul 19, 2018

Results have been announced for the research project ‘Integrated High-Volume Production along the LED Value-Added Chain for Large Wafers and Panels’ (InteGreat), which ran between December 2014 and February 2018 supported by the ...

Tags: packaging, LED product

Seoul Semiconductor's AC LED Modules Pass 4kv Surge Testing, Expanding Nanodriver Applications to Industrial and Commercial Lighting

May 21, 2018

Using its recently introduced NanoDriver Series LED driver, South Korean LED maker Seoul Semiconductor Co Ltd has demonstrated a 277VAC lighting module that complies with the industry-standard 4kV surge testing. Previously, AC LED modules ...

Tags: Seoul, Semiconductor, AC LED modules

Twin Rivers Paper to Buy Mondi's Paper Mill in Arkansas, US

Apr 8, 2018

US-based Twin Rivers Paper has signed an agreement to acquire Mondi Group’s paper mill in Pine Bluff, Arkansas. Terms of the deal, which is expected to be completed in the second quarter of this year, have not been disclosed. Pine ...

Tags: Twin Rivers Paper, Paper Mill

Siegwerk, Agfa Graphics Collaborate for Uv Digital Packaging Inks

Mar 7, 2018

Printing inks manufacturer Siegwerk has collaborated with prepress offset and inkjet print solutions supplier Agfa Graphics for UV digital packaging inks. The deal includes business transfer from Agfa Graphics to Siegwerk, featuring ...

Tags: Siegwerk, packaging inks

Eltete Group Acquires Complete Stake in Poland-Based Packprofil

Feb 23, 2018

Eltete Group, a provider of transport packaging solutions, has acquired the remaining 55% stake in Poland-based Packprofil. Eltete, which owned 45% stake in Packprofil before 2001, now became the sole owner of the company by purchasing ...

Tags: Eltete Group, edgeboards

GIS to Exhibit Latest Product Solutions for Functional and Decorative Printing at InPrint 2017

Nov 3, 2017

UK-based Global Inkjet Systems (GIS) is set to exhibit its latest product solutions for complex industrial applications in functional and decorative printing at this year’s InPrint show in Germany. The event will take place between ...

Tags: GIS, Decorative Printing

DS Smith Develops New Screw Cap Adapter for Bag-in-Box Packaging

Oct 24, 2017

DS Smith’s business unit Worldwide Dispensers Europe has developed a new screw cap adapter for bag-in-box packaging with an external tamper evident ring. The new screw cap adapter has been developed to replace previous system with ...

Tags: Bag-in-Box Packaging, Packaging

Toshiba Adds Second-Generation 650V SiC Schottky Barrier Diodes in DPAK Surface-Mount Package

Oct 24, 2017

Toshiba Electronic Devices & Storage Corp (TDSC) - spun off from Toshiba Corp in July - has enhanced its diode portfolio with the addition of six Schottky barrier diodes (SBDs) fabricated with silicon carbide (SiC) and housed in ...

Tags: Toshiba, Schottky Barrier, Package

Toyo Printing Inks to Showcase New Packaging Solutions at Eurasia Packaging

Oct 24, 2017

Toyo Printing Inks plans to exhibit its latest innovations in food and non-food packaging solutions during the Eurasia Packaging Fair 2017 in Istanbul, Turkey. The solutions to be demonstrated by the printing ink manufacturer are claimed ...

Tags: Toyo Printing, Packaging

Napco National to Showcase Food and Beverage Packaging Solutions at Gulfood Manufacturing Event

Oct 13, 2017

Saudi Arabia-based Napco National is set to exhibit a range of food and beverage packaging solutions at this year’s Gulfood Manufacturing event in Dubai, UAE. The event will take place from 31 October to 2 November at Dubai World ...

Tags: Food, Beverage Packaging

Solar-Tectic Granted US Patent for Low-Cost, High-Efficiency III-V Thin-Film Tandem Solar Cell on Glass Substrate

Oct 10, 2017

Solar-Tectic LLC of Briarcliff Manor, NY, USA says that the US Patent and Trademark Office has granted it US patent 15/205,316 ‘Method of Growing III-V Semiconductor Films for Tandem Solar Cells’ for high-efficiency and ...

Tags: Thin-film PV, Glass Substrate

Philips Photonics-LED European Consortium Completes VIDaP VCSEL Project

Sep 28, 2017

Philips Photonics of Ulm, Germany - which provides vertical-cavity surface-emitting laser (VCSEL) technology for datacom, consumer and industrial applications - has completed ‘VIDaP’ (VCSEL Pilot Line for Illumination, Datacom ...

Tags: VCSELs, LED

Osram Launches Osconiq LED Product Family for Professional Applications

Sep 8, 2017

Osram Opto Semiconductors GmbH of Regensburg, Germany says that its new Osconiq LED product line will cover professional applications including linear and area lighting, high- and low-bay lighting and street lighting. The familiar Duris P ...

Tags: Osram, LED Product

ProAmpac Acquires Clondalkin Flexible Packaging Orlando

Aug 23, 2017

Flexible packaging firm ProAmpac, part of the Pritzker Group Private Capital portfolio of companies, has completed the acquisition of Clondalkin Flexible Packaging Orlando from Holland’s Clondalkin Group. The companies did not ...

Tags: Flexible Packaging, Packaging

API to Launch New TA+ Cold Foil at LabelExpo Europe 2017

Aug 18, 2017

API is set to introduce new TA+ cold foil at this year’s LabelExpo Europe event in Brussels, Belgium. The event will take place from 25 to 28 September. The company has developed new cold foil for pack designers and printers to ...

Tags: API, printers

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