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Interposer
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POET's Revenue Grows 11.7% in Q2
Aug 20, 2018For second-quarter 2018, POET Technologies Inc of Toronto, Canada and San Jose, CA, USA — a designer and manufacturer of optoelectronic devices, including light sources, passive waveguides and photonic integrated circuits (PIC) for ...
Tags: photonic product, POET
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Cadence Offers IC Design Solutions For Fan-out Wafer-Level Chip Scale Packaging
Mar 16, 2016Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. Designed to accelerate the multi-chip integration for ...
Tags: Cadence Design system, IC, Packaging
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Murata's MLCC with Interposer Substrate to Reduce Noise
Jun 26, 2014Murata today announced the ZRB series of monolithic ceramic capacitorsThe main differences between ceramic dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit electrostatic ...
Tags: Electrical, Electronics, Capacitor
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A Multilayer Ceramic Capacitor Includes Flat Inner Electrodes
May 9, 2014A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrodeA solid electric conductor ...
Tags: Electrical, Electronics, ceramic capacitor
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An Electronic Component Includes an Interposer, and a Multilayer Ceramic Capacitor
May 7, 2014An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting ...
Tags: Electronic Component, Interposer
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Rudolph Technologies Today Released Three New Application-Specific Configurations
Jul 26, 2013Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its ...
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Asahi Glass Enters The Glass Interposer Market
Apr 2, 2013At the 2013 IEEE ISSCC researchers from Kobe Univ and the ASET group (Assoc. of Super Advanced Electronic Technologies) presented their work on "A 100 GB/s Wide IO with 4096b TSVs through an active silicon interposer with in place waveform ...
Tags: AGC Glass, Stacked Memory, IFTLE 141 100GB
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Asahi Glass Co. Has Made a $2.1 Million Investment in Triton Microtechnologies
Mar 14, 2013Asahi Glass Co (AGC) has made a $2.1 million investment in Triton Microtechnologies. Triton is based in Arizona, USA and owns via-fill technology for interposer substrate, to realise next-generation semiconductor packaging products using ...
Tags: AGC, investment, Triton Microtechnologies, ultra-thin glass
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AGC Contributes to The Acceleration of Next-Generation Semiconductor Packaging Development
Mar 14, 2013AGC (Asahi Glass Co., Ltd.; Head Office: Tokyo; President & CEO: Kazuhiko Ishimura) has made an investment totaling USD 2.1 million in Triton Microtechnologies, Inc. (Head Office: Arizona, U.S.), which owns cutting-edge via-fill technology ...
Tags: AGC, Triton Microtechnologies, glass
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Asahi Glass and Nmode Solutions Have Formed Triton Micro Technologies to Develop Via-Fill
Mar 13, 2013Asahi Glass and nMode Solutions of Arizona have formed a semiconductor packaging company called Triton Micro Technologies to develop via-fill technology using ultra-thin glass to make interposers for 2.5D and 3D semiconductors. "The ...
Tags: Asahi Glass, nMode Solutions of Arizona, semiconductor packaging
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AGC Has Made an Investment Totaling USD 2.1 Million in Triton Microtechnologies,Inc.
Mar 13, 2013AGC (Asahi Glass Co., Ltd.; Head Office: Tokyo; President & CEO: Kazuhiko Ishimura) has made an investment totaling USD 2.1 million in Triton Microtechnologies, Inc. (Head Office: Arizona, U.S.), which owns cutting-edge via-fill technology ...
Tags: AGC, glass, ultra-thin glass
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Imec Has Worked with Cadence to Validate an Automated 3D Chip Test Tool
Jan 23, 2013Imec has worked with Cadence Design Systems to validate an automated 3D design-for-test tool for logic-memory interconnects in DRAM-on-logic stacks. The tool, which is based on Cadence Encounter test software, was verified on an ...
Tags: Imec, Cadence Design Systems, logic-memory interconnects
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Toshiba Has Announced a Successor to The Cell Processor,Designed for High-End TVs
Dec 10, 2012Toshiba has announced a successor to the Cell processor,designed specifically for high-end TVs.Called Cevo Engine,it is a three-die system-in-package that includes a three-level hierarchy of co-processors.According to a Toshiba ...
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20 June 2012 NXP's 0.65mm X 0.44mm X 0.2mm SiGe:C GPS LNAs Offer 0.60Db Noise Figure
Jun 20, 201220 June 2012 NXP's 0.65mm x 0.44mm x 0.2mm SiGe:C GPS LNAs offer 0.60dB noise figure NXP Semiconductors N.V.of Eindhoven,The Netherlands,which provides mixed-signal and standard product solutions,has unveiled the BGU8006 low-noise ...
Tags: NXP Semiconductors, WLCSP, GPS LNAs, BGU8006 LNA
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GigOptix's HXR/T4104 High-Speed Optical Driver and Receiver Chipset Is Being Used
Jun 18, 2012GigOptix Inc of San Jose,CA,USA(a fabless supplier of semiconductor and optical components for high-speed information streaming)says that its HXR/T4104 high-speed optical driver and receiver chipset is being used in the high-speed data ...
Tags: GigOptix, Chipset, Semiconductor, Laser
