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Stacked Memory
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Intel Hopes to Take Hardware Performance to The Next Level with Xeon Phi Chip
Jul 7, 2014Intel hopes to take hardware performance to the next level with its latest Xeon Phi supercomputing chip, which packs an array of new hardware technologies that could eventually find their way to laptops and desktops. The new Xeon Phi ...
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EVG Achieved Strong Revenue Growth
Jul 11, 2013EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, says it has achieved strong revenue growth and expanded its headcount in Q1/2013. The firm attributes this to continuing demand for its flexible ...
Tags: EV Group, Electrical, Electronics
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EVG Introduced Its LowTemp Debonding Platform
Jul 8, 2013EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material ...
Tags: Electrical, Electronics
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Asahi Glass Enters The Glass Interposer Market
Apr 2, 2013At the 2013 IEEE ISSCC researchers from Kobe Univ and the ASET group (Assoc. of Super Advanced Electronic Technologies) presented their work on "A 100 GB/s Wide IO with 4096b TSVs through an active silicon interposer with in place waveform ...
Tags: AGC Glass, Stacked Memory, IFTLE 141 100GB