SEMICON articles & resources on Made-in-China.com

EpiGan Showcasing GaN Epiwafer Solutions for 5G

Aug 31, 2018

In booth J2554 of its local agent APEC at the SEMICON Taiwan show in Taipei (5-7 September) and in booth 354 at European Microwave Week (EuMW 2018) in Madrid, Spain (23-28 September), EpiGaN nv of Hasselt, near Antwerp, Belgium - which ...

Tags: GaN Epiwafer, epitaxial wafer

Rudolph to Unveil New Truebump Technology at Semicon Taiwan 2017

Sep 14, 2017

Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...

Tags: Rudolph, Semicon Taiwan 2017

ZEISS Enters Process Control Market

Jul 12, 2017

ZEISS Group of Oberkochen, Germany is fueling its growth strategy by expanding into the process control market. Through its new Process Control Solutions (PCS) business unit - part of the ZEISS Semiconductor Manufacturing Technology (SMT) ...

Tags: ZEISS, Control Market

Kulicke & Soffa to Take Part at SEMICON West 2017

Jul 12, 2017

Kulicke & Soffa said it will participate at SEMICON West trade show, which is being held in San Francisco, California. The company will give a video illustration of its lithography solution, developed for advanced packaging at the trade ...

Tags: SEMICON West, EV

Picosun Collaborating with Taiwan's NCTU and Atom Semicon on ALD

Jul 7, 2017

Atomic layer deposition (ALD) thin-film technology firm Picosun Oy of Espoo, Finland, Taiwan’s National Chiao Tung University (NCTU) and Atom Semicon Co Ltd of New Taipei City, Taiwan have begun a joint collaboration on the ...

Tags: GaN devices, Electro-Optical Engineering

Optomec 3D Printers Featured at Hong Kong Research Facility

Apr 24, 2017

Optomec said its printers were highlighted at the Grand Opening of the University 3D Printing Research (U3DP) facility at Hong Kong Polytechnic. Hong Kong Polytechnic currently owns an Optomec Aerosol Jet system for 3D printed electronics ...

Tags: 3D Printers, printing machine

Moore's Law and China's Fast-Growing IC Industry

Mar 20, 2017

At Semicon China 2017, executives at chip giant Intel, IC packager Advanced Semiconductor Engineering, equipment vendors ASML, Lam Research and Tokyo Electron (TEL), and nano-electronics research institute Imec talked about innovation to ...

Tags: IC, Semiconductor, IC Industry

Disco Develops Laser Ingot Slicing Method to Speed Sic Wafer Production and Cut Material Loss

Aug 12, 2016

Tokyo-based equipment maker Disco Corp has developed the KABRA (Key Amorphous-Black Repetitive Absorption) laser ingot slicing method. Implementing the process is said to enable high-speed production of silicon carbide (SiC) wafers, ...

Tags: SiC, Disco Corp, laser ingot slicing method

EV Group Unveils Automated Metrology System for Advanced Packaging

Jul 19, 2016

EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG50 automated metrology system. Designed to support the increasingly stringent manufacturing ...

Tags: Advanced Packaging, EV Group

IMEC Extends Global R & D Footprint with Opening of IMEC Florida

Jul 12, 2016

At its annual Imec Technology Forum (ITF) USA on 11 July, a half-day conference at the San Francisco Marriott Marquis hotel held in conjunction with the SEMICON West trade show and supported by industry association Semiconductor Equipment ...

Tags: IMEC, GaN-on-Si, III-Vs-on-silicon

China to Spur Power Device Developments in 2016

Mar 24, 2016

Market sectors encompassing telecommunications, consumer electronics, innovative energy applications in transportation, electricity generation and other market sectors are increasingly valuing power semiconductor devices as usage of these ...

Tags: AC driver, railway applications, high power

Kulicke & Soffa Launches Wafer Dicing Solution For Advanced Packaging

Mar 21, 2016

Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...

Tags: KulickeSoffa, FCC Hub Blades, AccuPlus series

Monocrystal Showcasing First 300kg Ky Sapphire Crystal at Semicon China

Mar 13, 2016

In booth #2321 at SEMICON China 2016 at the Shanghai New International Expo Centre (15-17 March), Monocrystal Inc of Stavropol, Russia (which manufactures large-diameter sapphire substrates and cores for LED, optical product and RFIC ...

Tags: Monocrystal, Sapphire substrates, LEDs

Advanced Energy Highlighting High-Speed Pyrometer for MOCVD at Semicon Korea

Feb 3, 2016

In booth 2712 (Hall A) at SEMICON Korea 2016 in Seoul (27-29 January), Advanced Energy Industries Inc of Fort Collins, CO, USA is highlighting its power and control technologies. Among its process power, high-voltage power and thermal ...

Tags: MOCVD, RF power

Solvay to Showcase Specialty Polymers at Semicon Taiwan 2015 for Fab Processes

Nov 10, 2015

Solvay Specialty Polymers, a world leader in the research, development and manufacturing of high-performance materials designed to master the most challenging requirements in the semiconductor industry, will showcase at Semicon Taiwan 2015 ...

Tags: Solvay, Specialty Polymers, Semicon Taiwan

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