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Coveris to Divest Americas Packaging Business for $1.32bn
Apr 4, 2018Packaging manufacturer Coveris has agreed to divest its Americas packaging business to Transcontinental (TC Transcontinental) in a deal worth $1.320bn. Coveris Americas, which is a subsidiary of Sun Capital Partners portfolio firm ...
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TC Transcontinental Buys US-Based Multifilm Packaging
Mar 9, 2018Canada-based TC Transcontinental has acquired US flexible packaging supplier Multifilm Packaging for an undisclosed sum. Based in Elgin of Illinois, Multifilm provides flexible packaging solutions for the food, beverage, and confectionery ...
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Qualcomm Announces RF Front-End Design Wins with Google, HTC, LG, Samsung and Sony Mobile
Jan 15, 2018Qualcomm Technologies Inc, a subsidiary of Qualcomm Inc of San Diego, CA, USA, has announced radio-frequency front-end (RFFE) design wins with leading original equipment manufacturers (OEMs) including Google, HTC, LG, Samsung and Sony ...
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RBW Graphics Upgrades Goss M-3000 Press
Nov 15, 2017TC Transcontinental – RBW Graphics has upgraded its Goss M-3000 press, as part of its efforts to expand its production operations. The company has completed a suite of upgrades to a Goss M-3000 press at its facility in Owen Sound, ...
Tags: RBW Graphics, CPU hardware
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Canada's Transcontinental Buys Flexstar Packaging
Oct 26, 2016Canada’s Transcontinental has acquired Flexstar Packaging, in a bid to expand its packaging operations in North America. Based in Richmond of British Columbia, Flexstar Packaging produces custom printed, laminated, flexible ...
Tags: Flexstar Packaging, Packaging
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Qorvo's Quarterly Revenue Grows by a More-Than-Expected 15%
Aug 10, 2016For fiscal first-quarter 2017 (to 2 July 2016), Qorvo Inc of Greensboro, NC and Hillsboro, OR, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has reported revenue of $697.6m, up ...
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Skyworks Acquires Remaining Stake in Filter JV with Panasonic
Aug 8, 2016Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) says that, for $76.5m, it has acquired the remaining 34% stake that it did not already own in the filter joint venture it created with ...
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UPM Raflatac Extends Self-Adhesive Label Products Range with BS5609 Approval
Jun 30, 2016UPM Raflatac has extended its range of self-adhesive label products that comply with section two of the internationally recognized BS5609 standard for self-adhesive labels for marine use. Five new product approvals bring the number of UPM ...
Tags: UPM, Raflatac label, RP77
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Tecnau to Exhibit CutReady Solution at Industry Events
Apr 5, 2016Tecnau’s CutReady solution will showcase cost-effectively cut and stack output from HP Indigo Digital Presses during several pre-drupa HP Indigo events in Israel, and then at drupa itself. The new Tecnau CutReady solution will be ...
Tags: Tecnau, CutReady Solution, HP Indigo Digital Presses, Industry Events
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EPC Publishes Reliability Report Documenting Over 17bn Field-Device Hours With Very Low Failure Rate
Mar 16, 2016Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA, which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications, has announced its Phase Seven Reliability ...
Tags: EPC, E-mode GaN FETs, GaN-on-Si
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Experts Find Serious Security Flaws in ZigBee Connected Devices
Nov 12, 2015Philips Hue LED bulbs and other smart home devices that incorporate ZigBee wireless standards are vulnerable to hacking, according to recent findings by IT firm Cognosec. At a Black Hat USA conference in Las Vegas recently Cognosec senior ...
Tags: Security Flaws, ZigBee devices, LED bulbs
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Transcontinental to Purchase Ultra Flex Packaging
Sep 11, 2015Transcontinental has entered into an agreement to buy US-based flexible packaging supplier Ultra Flex Packaging in a deal worth $80m. The amount requires to be paid in cash at closing, along with an additional consideration payable ...
Tags: Flex Packaging, TC Transcontinental, Packaging acquisition
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Mitsubishi Electric Is Launching The Ml562g84 638nm-Wavelength Red LD
Jun 29, 2015Tokyo-based Mitsubishi Electric Corp is launching the ML562G84 638nm-wavelength red laser diode (LD), offering what is claimed to be record output power (under pulsed operation) of 2.5W for a 638nm projector light source. The record ...
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IAF Holds Panel Discussion at Texprocess Forum
Apr 23, 2015As part of the Texprocess Forum programme, the International Apparel Federation (IAF) is organising a panel discussion titled ‘Making technology work in fashion’ in Hall 5.0 C06 on May 5, 2015. The panelists of this session ...
Tags: Panel Discussion, Texprocess Forum
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Knowles Expanded Its Dli 'UX' Ultra-High K Dielectric
Mar 20, 2015Knowles has expanded its DLI ‘UX’ ultra-high K dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit electrostatic attraction and repulsion to take place across ...
Tags: material, capacitor, Electronics
