Jing Zhang, a faculty member at Rochester Institute of Technology, has received a CAREER award from the US National Science Foundation (NSF) for work to develop new, highly efficient ultraviolet light sources. Zhang’s NSF award of ...
Tags: UV LEDs, UV Photonics
Rotary filling systems producer Fogg Filler has introduced new enclosure, which can be used on all filling and rinsing machines. The new enclosure features stainless steel door frames, which enables to monitor the rinsing and filling ...
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won an ...
Tags: SPTS, GaN-on-SiC, LED
Komori Europe Corporation and Highcon Systems have entered into a strategic selling agreement, further strengthening the existing Highcon relationship with Komori in Japan and America. Komori Europe is in the process of installing a ...
Tags: Komori Europe, Highcon Systems
Naura Technology (formerly Beijing Sevenstar Electronics) has started shipping ion etch equipment for the manufacture of 14nm chips to chipmakers, while Advanced Micro-Fabrication Equipment (AMEC) is being engaged in the development of etch ...
Tags: chipmakers, Electronics, chip
China National Energy Administration released statistics right after the Lunar New Year: Up until late-2016, the cumulative PV installation reached 77.42GW in China. The newly-added installation reached 34.54GW in 2016, a doubled growth ...
Tags: PV installation, mono-Si modules
Plasma etch and deposition equipment maker CORIAL S.A.S. of Bernin, France has announced the availability of hard materials deep etch processes using a new generation of 200mm ICP-RIE (inductively coupled plasma reactive-ion etch) ...
Tags: CORIAL S.A.S., Plasma etch, hard materials deep etch processes
Jing Zhang, an engineering faculty member at Rochester Institute of Technology, has received a $305,000 grant from the US National Science Foundation (NSF) to acquire an inductively coupled plasma reactive-ion etching (ICP-RIE) system for ...
Tags: RIT, NSF, ICP-RIE system
UK-based process equipment maker Oxford Instruments has announced the development and launch of a silicon carbide (SiC) via plasma etch process using its PlasmaPro100 Polaris etch system. SiC is becoming an increasingly important ...
Tags: Oxford Instruments, SiC, GaN RF devices
Imec and Ghent University in Belgium have used aspect ratio trapping (ART) techniques to produce indium gallium arsenide (InGaAs) multiple quantum wells (MQWs) on 300mm-diameter silicon in a ridge format that could be used in future laser ...
Tags: InGaAs MQWs, InGaAs Laser diodes, Imec and Ghent University
A team of researchers at the USA's Massachusetts Institute of Technology (MIT) and the Masdar Institute of Science and Technology in Abu Dhabi, United Arab Emirates has developed a new solar photovoltaic 'step cell' that combines two ...
RASIRC Inc of San Diego, CA, USA (whose products purify and deliver ultra-pure liquids and gases) has renewed its funding agreement with the University of California, San Diego (UCSD) for on-going semiconductor processing research. The gift ...
South Korea's Seoul National University has integrated two Advanced Vacuum plasma processing systems from equipment maker Plasma-Therm LLC of St Petersburg, FL, USA into its nanotechnology fabrication lab, which supports multiple users ...
Yale University and University of Illinois Urbana in the USA have improved the efficiency of gallium arsenide phosphide (GaAsP) solar cells on silicon (Si) by reducing threading dislocation densities (TDDs) [Kevin Nay Yaung et al, Appl. ...
Tags: GaAsP solar cells, GaAsP, MBE, MOCVD
Researchers in Germany have been developing an epitaxial lift-off (ELO) process that would allow gallium arsenide (GaAs) substrates to be reused for indium gallium aluminium phosphide (InGaAlP) thin-film light-emitting diode (LED) ...