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Taiwan Semiconductor Manufacturing Raised About $810m Through The Sale of Bonds
Dec 11, 2012The new deal includes a NT$10.6bn ($363M) five-year bonds, a NT$10bn ($342M) bond for seven years and a NT$3bn ($102M) 10-year bond. Contract chip manufacturer Taiwan Semiconductor Manufacturing has raised about NT23.6bn ($810m) through ...
Tags: semiconductor, fab module, phase module, nanometer system
