Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...
Cambridge Nanotherm Ltd of Haverhill, Suffolk, UK, a producer of nanoceramic thermal management technology, says that its Nanotherm LC thermal management solution addresses the unique needs of chip-scale packaged (CSP) LEDs. CSP LEDs have ...
The global light-emitting diode (LED) packaging equipment market will rise at a compound annual growth rate (CAGR) of almost 2% to more than $656m in 2020, according to a report by Technavio. The report considers the emergence of COB ...
Tags: LED, packaging equipment, COB
At the International Symposium on 3D Power Electronics, Integration and Manufacturing Symposium in Raleigh, NC, USA (13-15 June), power management component supplier Sarda Technologies of Durham, NC, USA announced a collaboration to ...
In booth 10.2/L36 at the ANGA COM 2016 Exposition & Congress for Broadband, Cable and Satellite in Cologne, Germany (7-9 June), Qorvo Inc of Greensboro, NC and Hillsboro, OR, USA (which provides core technologies and RF solutions for ...
Tags: Qorvo, CATV, MCM Amplifiers
"Recognition from the Queen is a tremendous honour and allows everyone involved in Micro Drone's development to be proud of our progress so far." Extreme Fliers has placed among a list of select business recognised as winners of the 2016 ...
Mercedes-Benz Style has joined hands with Italian light design company Artemide and the two companies will showcase their latest product at the “Light + Building” trade fair in Frankfurt. It embodies the Mercedes-Benz design ...
Tags: VMercedes-Benz, Artemide, Frankfurt, Light, Building
At the Light + Building 2016 trade fair in Frankfurt, Germany (13-18 March), Osram Opto Semiconductors GmbH of Regensburg, Germany is unveiling its Duris P 10 LED, suitable for use in professional outdoor lighting systems. Offering typical ...
LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has launched what is claimed to be a first-in-class 2400W high-power horticultural flip-chip COB, as part of its new Duet series, geared towards the grow light industry. ...
Tags: COB LED, LED lighting
LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has launched what it claims is a first-in-class 2400W high-power LED flip-chip chip-on-board (COB) LED as part of its flagship Apollo series based on the firm's patented ...
Flip Chip Opto introduces new high powe LED Flip Chip COB with 2,400 watt. (Flip Chip Opto/LEDinside) Flip Chip Opto releases a first-in-class 2400 watt high-power LED Flip Chip COB. The 2400 watt Flip Chip COB is part of their flagship ...
Tags: Flip Chip Opto, stadium lighting, nautical spotlighting
The LED industry is gradually maturing in 2015, with products cost/performance (C/P) ratio becoming increasingly important. Low and mid-power flip chip products are increasingly valued by the industry. To further understand this trend ...
Tags: LED industry, LED chip, Chip Scale Packaging
LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has launched 2000W high-power LED chip-on-board (COB) products using its patented 3-Pad LED flip chips and Pillar Metal Core printed-circuit board (P-MCPCB) technologies. ...
Tags: Flip Chip Opto, LED Flip Chips, PCBs
Panasonic Corp of Osaka, Japan is launching what it claims is the industry's smallest enhancement-mode (E-mode) gallium nitride (GaN) power transistor, encapsulating into an 8x8 dual-flat no-lead (DFN) 'X-GaN' surface-mount package. A ...
Tags: Panasonic, GaN Power Transistor
Supported by the German Ministry for Education and Research (BMBF) as part of the 'Photonic Process Chains' initiative, the project 'Integrated High-Volume Production along the LED Value-Added Chain for Large Wafers and Panels' (InteGreat) ...
Tags: Osram HB-LEDs, BMBF, Electronics