CRAIC Technologies of San Dimas, CA, USA has introduced the FilmPro film thickness measurement software package, designed to plug in to the firm’s microspectrophotometers and their controlling Lambdafire software to allow measure rapid and non-destructive measurement of thin-film thickness.
Able to analyze films of many materials on both transparent and opaque substrates, FilmPro enables the user to determine thin-film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. The powerful and flexible software can be used in many different fields and in everything from research to industrial settings, adds the firm.
“Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products,” says president Dr Paul Martin. “This software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates.”
The complete CRAIC microspot film thickness solution combines an advanced microspectrophotometer with the FilmPro software. The software is a plug-in module to CRAIC Lambdafire instrument control software. It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates. Due to the flexibility of the CRAIC design, sampling areas can range from over 100 microns across to less than a micron. Designed for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes, and tools for analyzing data. With the addition of spectral mapping from CRAIC, film thickness maps of entire devices can be created.
