Singapore-based Kulicke & Soffa Industries has introduced new ACS Pro Capillary, which can be used in advanced copper wire bonding applications.
The new ACS Pro Capillary will offer better bond-ability control with fine wire diameters, and improves the quality and strength of the Intermetallic Coverage.
The ACS Pro Capillary is expected to improve design dynamics, and also expands the copper process window with enhancement of process portability and response consistency.
Kulicke & Soffa wire bond solutions business unit vice president Nelson Wong said the company continues to leverage its strong R&D process knowledge and extensive experience in delivering copper capillaries.
"With ACS Pro, customers will benefit from the excellent bond-ability control, consistent performance, while also lowering their cost of ownership," Wong added.
The ACS Pro Capillary will be showcased at Semicon Taiwan show in the Taipei World Trade Center, which will held between 4 to 6 September, 2013.
