Trade Resources Industry Views FKUR and Corbion Established Partnership to Develop PLA Compounds for Applications

FKUR and Corbion Established Partnership to Develop PLA Compounds for Applications

Tags: Packaging

Bioplastic manufacturer FKuR Kunststoff and lactic acid derivatives and lactides producer Corbion Purac have established partnership to develop poly lactic acid (PLA) compounds for applications that are heat-resistant and GMO-free.

The new bioplastic compounds will be used in various applications that include both food and non-food packaging, as well as several durable products such as toys and office supplies.

Corbion noted that both the companies specifically intend to develop those applications, where there is requirement for high temperature resistance, which could not work with many standard bioplastics till now.

Both partners have agreed to a common development, in order to develop new markets for the compound.

The companies also plan to focus on the optimization of mechanical properties to increase the range of applications, and to adapt the polymers to run on existing processing equipment, besides heat resistant compounds.

Reducing the cycle time of PLA, particularly during the process of injection molding, is part of the development project, said Corbion.

FKuR has begun systematic testing using PLA based on lactides from Corbion in its formulations, after completing the initial trials in October 2013.

Heat resistant thermoformed food tray produced from Bio-Flex F 6611 by Plastisud is one of the first commercial applications developed from this work, according to Corbion.

FKuR Kunststoff CEO Edmund Dolfen said, "We are very excited about this strategic partnership with Corbion Purac and the technical capabilities of the PLA which offers us incomparable opportunities to design high engineered bio-compounds."

Source: http://sustainablepackaging.packaging-business-review.com/news/fkur-corbion-to-develop-pla-compounds-for-packaging-applications-150514-4268001
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Fkur, Corbion to Develop PLA Compounds for Packaging Applications