Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA (which makes high-power semiconductor laser components) has announced the commercial availability of its actively cooled laser bars, emitting 200W of ...
O-Net Technologies (Group) Ltd of Shenzhen, China (which provides optical networking products for telecoms and datacoms applications) has launched a 980nm uncooled pump laser in small-form-factor TO-Can package, a high-power laser for ...
Crown Asia Pacific has developed a new generation of lightweight SuperEnd beverage end to provide beverage manufacturers with a novel sustainable option. Compared to conventional 202 diameter (52mm) ends, Crown's Interchangeable SuperEnd ...
In booth #159 at the European Conference on Optical Communications (ECOC 2017) in Gothenburg, Sweden (18-20 September), optical and photonic optical component and subsystem maker Lumentum Holdings Inc of Milpitas, CA, USA is highlighting ...
With the migration from 10G and 40G to 100G data rates accelerating considerably until 2020 (with more than 15 million 100G ports expected to be deployed), Source Photonics Inc of West Hills, CA, USA (which provides broadband access optical ...
Tags: Source Photonics, Transceiver
The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density ...
Tags: pluggable interface, hardware
MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is showcasing its portfolio of optoelectronics and photonic ...
Tags: semiconductors, components
Vpak has released the third generation Tru-Def video-in-print screens using latest in screen resolution technology. Vpak now offers more screen size and resolution options than anyone in the Video-In-Print industry "With this ...
Tags: Vpak, Video-In-Print industry
Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...
Tags: Rudolph, Semicon Taiwan 2017
Osram Opto Semiconductors GmbH of Regensburg, Germany is expanding its existing portfolio for flash applications with a product featuring a specially developed chip-scale package (CSP). With Ceramos C, Osram is following the trend for ...
Tags: Osram, Mobile Devices
The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical technology. Under the MSA, 22 participating companies are addressing the technical challenges ...
Tags: Nokia, Microsoft, Optical Links
Packaging Innovations London 2017 has partnered with the Pentawards to provide its visitors with a dedicated design-focused conference. The Pentawards Conference will run throughout Packaging Innovations and Luxury Packaging London 2017, ...
Tags: Packaging, Luxury Packaging
Bosch has revealed what it describes as a start-up powertrain for electric vehicles. It’s now common knowledge that a more powerful battery will increase an electric car’s range. But can a new powertrain have a comparable ...
Tags: electric vehicles, powertrain
US-based B&G Foods is extending its line of Green Giant frozen veggie swap-ins with new Green Giant Veggie Spirals. The pasta alternatives initially will be available in zucchini, carrots and butternut squash varieties. They are ...
Tags: B&G Foods, frozen product
Toyo Ink Group is set to exhibit its latest label and packaging solutions at this year’s Labelexpo Europe event in Belgium. Toyo Ink Group’s members Toyo Ink Europe and Toyo Ink Co will exhibit their latest developments for ...
Tags: Labelexpo Europe 2017, Toyo, Packaging