Semiconductor process equipment maker SAMCO Inc of Kyoto, Japan is employing about 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein, in order to better ...
Tags: Samco
Xaar will launch a new Thin Film silicon MEMS technology platform at drupa 2016. Xaar's printheads are at the heart of a vast number of industrial inkjet print systems around the world delivering both production efficiencies and increased ...
Tags: Xaar, MEMS technology, Drupa 2016
Nanoelec Research Technological Institute (IRT) in Grenoble, France - an R&D consortium headed by CEA-Leti focused on information and communication technologies (ICT) using micro- and nanoelectronics - has announced the first co-integration ...
Tags: III-Vs-on-Si, Direct wafer bonding
In booth 3809 at the Optical Fiber Communication Conference & Exhibition (OFC 2016) in Anaheim, CA, USA (22-24 March), engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA is showcasing a broad portfolio ...
Tags: II-VI Inc, OFC, Monitoring super-channels
X-FAB Silicon Foundries of Erfurt, Germany - a mixed-signal IC, sensor and micro-electro-mechanical systems (MEMS) foundry – has entered wide-bandgap semiconductor production by announcing the availability of silicon carbide (SiC) ...
Tags: SiC MOSFET SiC Schottky barrier diodes SiC power devices
Nanoelectronics research center imec of Leuven, Belgium has opened its new 300mm cleanroom. With this 4000m2 new facility, imec's semiconductor research cleanrooms (dedicated to scaling IC technology beyond 7nm) now total 12,000m2. Global ...
At the SEMI Industry Strategy Symposium Europe 2016 conference in Nice, France (6–8 March), Paul Lindner, executive technology director at EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for ...
Tags: EV Group, Engineered substrates
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has been ...
Tags: SPTS, ESTnet Awards
Three-dimensional televisions are not successful because their 3D images do not meet people's expectations. Viewers have to wear 3D glasses, and visual fatigue prevents long-duration viewing. An ideal 3D display technique that overcomes ...
Tags: Micromirrors, 1D Scanning, Display
ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment (especially for emerging markets and other cost-conscious users of ≤200mm substrates), has announced the purchase of its 8-chamber Solstice ...
FormFactor Inc of Livermore, CA, USA (which provides wafer test technologies and expertise) has agreed to acquire Cascade Microtech Inc of Beaverton, OR, USA (which provides equipment enabling precision contact, electrical measurement and ...
Tags: LED devices, wafer
Tsinghua Unigroup of mainland China announced on Dec. 11 to acquire a 24.9 percent holding in Siliconware Precision Industries Co., Ltd. (SPIL) and a 25 percent stake in ChipMOS Technologies (Bermuda) Ltd. for total cost of NT$68.8 billion ...
Tags: Tsinghua Unigroup, semiconductor, Processing Machinery
EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...
ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment (especially for emerging markets and other cost-conscious users of smaller substrates), has opened a new European sales and support office in ...
Tags: ClassOne, wet processing equipment, sensors, LEDs
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference--a leading ...