Brewer Science Inc of Rolla, MO, USA, which provides thin-wafer-handling materials, processes and equipment, has unveiled the Apogee bonder for temporary wafer bonding applications. The firm says that this marks a milestone in leveraging ...
Tags: Electrical, Electronics, Industrial Equipment, Components
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has shipped an EVG510 semi-automated wafer bonding system and an EVG620 automated bond ...
Tags: EV Group, wafer bonding system
With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...
Tags: Electrical, Electronics
Researchers in Taiwan have produced indium gallium arsenide (InGaAs) metal-oxide-semiconductor capacitors (MOSCAPs) with low interface trap densities directly on silicon [Yueh-Chin Lin etal, Appl. Phys. Express, vol7, p041202, 2014]. InGaAs ...
At the Strategies in Light 2014 conference & exhibition in Santa Clara, CA, USA, EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and ...
University of California Santa Barbara (UCSB) and epiwafer foundry IQE Inc have developed 1.3μm-wavelength indium arsenide (InAs) quantum dot (QD) lasers grown on silicon (Si) with “record performance” [Alan Y. Liu et al, ...
Tags: Silicon, `Quantum Dot Lasers
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and semiconductor applications, says that the Singapore-MIT Alliance for Research ...
Tags: EV Group Bonding, Wafer Bonding
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®720 automated UV nanoimprint lithography (UV-NIL) system. Providing full-field ...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced the EVG®720 automated UV nanoimprint lithography (UV-NIL) system. Providing full-field ...
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and semiconductor applications, has launched the EVG 720 automated ultraviolet ...
Tags: electrical, LED, EVG
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and semiconductor applications, has introduced the EVG PHABLE exposure system, which is ...
Tags: EVG PHABLE, non-contact litho system, manufacturing photonic components
The Fraunhofer Institute for Solar Energy Systems ISE in Freiburg, Germany, concentrated photovoltaic (CPV) system maker Soitec of Bernin, France, micro/nanotechnology R&D center CEA-Leti in Grenoble, France and the Helmholtz Zentrum Berlin ...
Tags: Fraunhofer ISE Leti Soitec CPV Helmholtz, Electrical, Electronics
University of Tokyo has improved the temperature performance of 1.3μm quantum dot (QD) laser diodes bonded to silicon [Katsuaki Tanabe et al, Appl. Phys. Express, vol6, p082703, 2013]. Photonic circuits are commonly created in silicon, ...
Tags: Quantum Dot Lasers, Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, says it has achieved strong revenue growth and expanded its headcount in Q1/2013. The firm attributes this to continuing demand for its flexible ...
Tags: EV Group, Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material ...
Tags: Electrical, Electronics