Dow Performance Silicones has introduced new non-migrating silicone additive for bi-axially oriented polypropylene (BOPP) film. The new Dow Corning HMB-6301 Masterbatch is a patent-pending solution, which will facilitate packaging ...
Tags: silicone additive, BOPP film
After being showcased at the International Conference on Silicon Carbide and Related Materials (ICSCRM 2017) in Washington DC, USA (17-22 September), Tokyo-based Sumitomo Electric Industries Ltd (SEI) has launched the EpiEra high-quality ...
Tags: Sumitomo Electric, SiC Epiwafer
In-situ metrology system maker LayTec AG of Berlin, Germany recently shipped a comprehensive EpiCurve TT/Pyro 400 in-situ metrology hybrid system to an industrial customer in North America. The metrology station combines automated in-situ ...
Tags: MOCVD, GaN-on-SiC
Solar-Tectic LLC of Briarcliff Manor, NY, USA says that the US Patent and Trademark Office has granted it US patent 15/205,316 ‘Method of Growing III-V Semiconductor Films for Tandem Solar Cells’ for high-efficiency and ...
Tags: Thin-film PV, Glass Substrate
Valmet has delivered three IQ Moisturizers to Dunapack Mosburger's corrugated line in Strasswalchen, Austria, which will allow the plant to improve corrugated box quality and performance. The moisturizing system is used to rectify all ...
Canada-based Nova Chemicals has introduced three new sealant resins for flexible packaging applications. The new resins, including VPsK914, SPsK919 and SPs116, can be used in applications such as hot fill and institutional packaging. ...
Tags: Nova Chemical, Flexible Packaging
Honda Foundation (a public-interest incorporated foundation created by Honda Motor Co Ltd’s founder Soichiro Honda and his younger brother Benjiro Honda) says that the Honda Prize 2017 will be awarded to Kyoto University professor ...
Tags: Power Devices
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has shipped multiple TurboDisc EPIK 868 gallium nitride (GaN) metal-organic chemical vapor deposition (MOCVD) systems to several leading Chinese ...
Tags: LED Production, LED
At the International Conference on Silicon Carbide and Related Materials (ICSCRM 2017) in Washington DC (17-22 September), Tokyo-based Mitsubishi Electric Corp unveiled a silicon carbide (SiC) metal-oxide-semiconductor field-effect ...
Tags: Power Device, Mitsubishi, SiC Mosfet
Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA (which makes high-power semiconductor laser components) has announced the commercial availability of its actively cooled laser bars, emitting 200W of ...
ITT Enidine will demonstrate a range of custom motion control solutions for the packaging industry at Pack Expo to be held in Las Vegas from September 25 to 27, 2017. The Enidine’s products have been designed for demanding packaging ...
Tags: ITT Enidine, Pack Expo, packaging
With the migration from 10G and 40G to 100G data rates accelerating considerably until 2020 (with more than 15 million 100G ports expected to be deployed), Source Photonics Inc of West Hills, CA, USA (which provides broadband access optical ...
Tags: Source Photonics, Transceiver
Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for power devices - which have already been marketed under the trade name High-Grade Epi (HGE) - ...
Tags: SiC power devices, semiconductors
Berlin Packaging, the supplier of plastic, glass, and metal containers and closures, has announced the launch of a newly-designed website for Dangerous Goods, its division that has been helping companies safely and economically ship ...
Tags: Berlin Packaging, Packaging
Osram Opto Semiconductors GmbH of Regensburg, Germany is expanding its existing portfolio for flash applications with a product featuring a specially developed chip-scale package (CSP). With Ceramos C, Osram is following the trend for ...
Tags: Osram, Mobile Devices