Pro Mach, Inc. Cincinnati, OH, announced July 17 that its ID Technology division has acquired Colet, a leading label manufacturer and provider of packaging supplies. Toronto, Ontario-based Colet, will serve as ID Technology's first label ...
SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing. SEMICON Taiwan 2013, to be held ...
Tags: Semiconductor Market, Electrical
The laser unit is a versatile 'contour' unit and is capable of laser scribing and cutting a wide range of materials, to a specified depth and shape, according to the company. According to Parkside, the scribe produces an easy-opening ...
Tags: laser, Industrial Equipment, Packaging, Printing
Printed flexible packaging manufacturer Parkside Flexibles has announced the installation of new laser technology at its Normanton facility in the UK. Located in a purpose built, positive-pressurized unit within the company's existing ...
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, says it has achieved strong revenue growth and expanded its headcount in Q1/2013. The firm attributes this to continuing demand for its flexible ...
Tags: EV Group, Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material ...
Tags: Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, and manufacturer of chemicals for the electronics industry Dynaloy LLC (a wholly owned subsidiary of Eastman Chemical Company) have introduced ...
Tags: lithography equipment, Electrical, Electronics, compound semiconductor
Peregrine Semiconductor Corp of San Diego, CA, USA, a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-sapphire (SOS), has signed a collaborative agreement with Japan’s Murata Manufacturing Company ...
The global market for advanced packaging solutions that includes active, controlled, intelligent packaging, and advanced packaging components was at $31.4 billion in 2011, according to a report from BCC Research entitled Active, Controlled, ...
Tags: Market, Packaging, Advanced Packaging
Global supplier of advanced packaging technology Baumann has introduced its new high speed blister packing line for safe product packaging. According to Baumann, the line is made up of modular machines that work synchronized with each ...
For first-quarter 2013, GigOptix Inc of San Jose, CA, USA (a fabless supplier of analog semiconductor and optical communications components enabling high-speed end-to-end information streaming over optical fiber and wireless networks) has ...
Tags: GigOptix, Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced the latest version of its EVG120 automated resist processing system. Incorporating new features and improved productivity in an ...
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three ...
Tags: Semiconductor, Semiconductor Materials, Electrical, Electronics
Jack Mans, Plant Operatiions Editor -- Packaging Digest, 4/1/2013 10:48:05 AM Aerofil Technology Inc. (ATI) began its operations in Sullivan, MO, in the fall of 1988 with two small aerosol lines and less than 50,000 sq ft of space. Since ...
At the 2013 IEEE ISSCC researchers from Kobe Univ and the ASET group (Assoc. of Super Advanced Electronic Technologies) presented their work on "A 100 GB/s Wide IO with 4096b TSVs through an active silicon interposer with in place waveform ...
Tags: AGC Glass, Stacked Memory, IFTLE 141 100GB