ITT Enidine will demonstrate a range of custom motion control solutions for the packaging industry at Pack Expo to be held in Las Vegas from September 25 to 27, 2017. The Enidine’s products have been designed for demanding packaging ...
Tags: ITT Enidine, Pack Expo, packaging
BorgWarner, a company involved in the sale of products in the aftermarket business, is now offering its Wahler-branded products in a new white and blue box design. The new packaging has been introduced as part of the company’s ...
Tags: BorgWarner, Packaging, Wahler Products
Honda, Japanese manufacturer of automobiles, aircraft, motorcycles, and power equipment, has declared the launch of the 2017 Honda Clarity Electric sedan at selected dealerships in California and Oregon. The vehicle is powered by ...
Tags: Clarity Electric, motorcycles
To keep pace with the dramatic size and weight reductions in laptop designs over the last 10 years, Navitas Semiconductor Inc of El Segundo, CA, USA has launched what it claims is the smallest 65W USB-PD (Type C) adapter reference design. ...
Tags: GaN Power, Laptop Adapter
Epson will demonstrate its robot and label printing technologies at Pack Expo to be held in Las Vegas from September 25 to 27, 2017. Epson Robots, a global leader in PC-controlled precision factory automation, will launch its all-in-one ...
Tags: label printers, Epson, Pack Expo
Universal Robots, a Danish manufacturer of smaller flexible industrial collaborative robot arms, said it will showcase its new scalable packaging solutions at this month’s PACK EXPO 2017 in Las Vegas to address the rapid-changing ...
Tags: Packaging, PACK EXPO 2017
South Korean LED maker Seoul Semiconductor Co Ltd has filed a lawsuit, together with its affiliate Seoul Viosys Co Ltd, in the US District Court for the Central District of California asserting that Archipelago Lighting Inc is selling ...
Tags: LED bulb, LED packaging
During the 67th Anternational Motor Show, as known as InternationaleAutomobil-Ausstellung (IAA), the world's largest motor show taking place in Frankfurt, Germany, annually, several heavy-weight exhibitors expressed growing worries that ...
Tags: Car Manufacturers, EV
The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density ...
Tags: pluggable interface, hardware
Creative Edge Software plans to launch the iC3D v5.0 packaging design software at this month’s Labelexpo Europe label event in Brussels. In version 5.0 of iC3D, five major new features have been added by the software firm to expand ...
Plastic packaging manufacturer Greiner Packaging has designed new ayran cup for dairy products producer Bayerische Milchindustrie (BMI). The new plastic cup, which is the reminiscent of the copper cups, features metal-hammertone look and ...
Berlin Packaging, the supplier of plastic, glass, and metal containers and closures, has announced the launch of a newly-designed website for Dangerous Goods, its division that has been helping companies safely and economically ship ...
Tags: Berlin Packaging, Packaging
RPC Superfos has proovided new packaging solution for Israel paint company Nirlat. The new design for Nirlat retains the appearance of the company’s previous container while providing greater functionality and shelf presence. ...
Tags: RPC Superfos, packaging
The new ranges include licensed offerings as well as original products. Top UK puzzles company Gibsons has unveiled a series of new ranges including new additions to its licensed offerings in the form of the Twister jigsaw puzzle and new ...
Tags: Gibsons, Enid Blyton products
Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...
Tags: Rudolph, Semicon Taiwan 2017