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IPC APEX EXPO
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Air Products to Launch New Flux-Free Soldering Technology for Wafer Level Packaging Applications
Feb 22, 2018Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...
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Experts Will Teach 29 Professional Development Courses at IPC APEX EXPO
Feb 28, 2014Experts from throughout the global electronics manufacturing industry will teach 29 professional development courses as part of a comprehensive educational program at IPC APEX EXPO, March 23, 24 and 27, at the Mandalay Bay Convention Center ...
Tags: IPC APEX EXPO, Courses Deliver, Electronics Manufacturing
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Dow Chemical Has Expanded Its Fortegra Line of Toughening Technology
Feb 27, 2013Dow Chemical has expanded its Fortegra line of toughening technology designed to help improve the toughness of epoxy systems for electrical laminates, as well as structural adhesives, composites, castings and coatings. The new addition, ...
