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Asahi Glass Enters The Glass Interposer Market
Apr 2, 2013At the 2013 IEEE ISSCC researchers from Kobe Univ and the ASET group (Assoc. of Super Advanced Electronic Technologies) presented their work on "A 100 GB/s Wide IO with 4096b TSVs through an active silicon interposer with in place waveform ...
Tags: AGC Glass, Stacked Memory, IFTLE 141 100GB
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Swiss Researchers Have Worked with IBM to Design a Very High Speed Data Converter
Mar 12, 2013Swiss researchers have worked with IBM to design a very high speed data converter which will operate at speeds up to 100Gbit/s. IBM Research has worked with Ecole Polytechnique Fédérale de Lausanne (EPFL) in Switzerland on ...
Tags: IBM, high speed data converter, company news
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French Researchers Has Used to Process The First Printed ADC to Be Fabricated on Plastic
Mar 1, 2013Plastic electronics technology developed in Europe has used to process the first printed analogue-to-digital converter (ADC) to be fabricated on plastic foil. This work is collaboration between CEA-Liten, Eindhoven University of ...
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AMD Presented Jaguar at ISSCC,Its Four Core X86-64 Processor for SoCs
Feb 26, 2013AMD presented Jaguar at ISSCC, its four core x86-64 processor for SoCs which can throttle down to 0.5W, or up to over 1.85GHz and 25W. The 28nm 11 metal layer processor occupies 26.2mm2, and "is implemented with an emphasis on design ...
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IBM Revealed Details of 5.5GHz System Z Microprocessor Chip in 32nm High-K CMOS at ISSCC
Feb 25, 2013IBM revealed details of its 5.5GHz System z microprocessor chip in 32nm high-k CMOS at ISSCC this year. Each chip has six processor cores, compared with four in its 45nm predecessor and, to form a plug-in processing element, six chips ...
Tags: IBM, microprocessor chip, company news
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The IEEE ISSCC Is an Important Gathering for The Electronic Engineering Industry
Feb 25, 2013The IEEE ISSCC (International Solid State Circuits Conference), which runs this year from February 17-21 in San Francisco, is an important gathering for the electronic engineering industry. It is the world's show case for the best in ...
Tags: IEEE ISSCC, electronic engineering industry, electronics, circuit design
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Held Every Year in February,The IEEE's ISSCC Is The World Showcase for Innovative Design
Feb 25, 2013Held every year in February in San Francisco, the IEEE's International Solid State Circuits Conference (ISSCC) is the world showcase for innovative circuit design. This is the 60th conference, and year's theme is '60 years of (em)powering ...
Tags: IEEE, ISSCC, circuit design
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ISSCC Is The World Showcase for Innovative Circuit Design
Feb 21, 2013ISSCC 2013 - 60th Anniversary Held every year in February in San Francisco, the IEEE's International Solid State Circuits Conference (ISSCC) is the world showcase for innovative circuit design. This is the 60th conference, and year's ...
Tags: Circuits Conference, capacitors, inductors
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IBM Revealed Details of 5.5GHz System Z Microprocessor Chip in 32nm High-K CMOS at ISSCC
Feb 21, 2013IBM revealed details of its 5.5GHz System z microprocessor chip in 32nm high-k CMOS at ISSCC this year. Each chip has six processor cores, compared with four in its 45nm predecessor and, to form a plug-in processing element, six chips are ...
Tags: IBM, Core Processor, microprocessor chip
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Introduced The Industry's Densest 128Gbit NAND Flash Memory Device
Feb 19, 2013Micron Technology today introduced the industry's densest 128Gbit NAND flash memory device utilizing its 20-nanometer (nm) process technology and packing three bits of data per cell into the chip. Three-bit flash technology is referred to ...
Tags: Micron Technology, flash memory device, process technology
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Micron Technology Has Introduced Its Smallest 128Gbit NAND Flash Memory Fabbed on a 20nm
Feb 16, 2013Micron Technology has introduced its smallest 128Gbit NAND flash memory fabbed on a 20nm process. The memory device uses a triple-level-cell (TLC) design which stores three bits of information per cell. This means the device is ...
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China Will Take The Wraps off Its Latest 8-Core Godson Processor
Dec 31, 2012IDG News Service - China will take the wraps off its latest 8-core Godson processor early next year to show its chip-making ability compared to Intel, Advanced Micro Devices and ARM. Loongson Technology, partly funded by the Chinese ...
Tags: PCs, Servers, 8-core Godson processor, Intel, Advanced Micro Devices, ARM
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Tim Laverick Has Joined It as VP,Infrastructure Prod
May 30, 2012RF and mixed-signal semiconductor maker Anadigics Inc of Warren,NJ,USA says that Tim Laverick has joined it as VP,infrastructure products,and Robert Bayruns has been promoted to VP&chief technology officer.Laverick is a business and ...
Tags: Anadigics, VP, CTO, semiconductor, microwave