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RF Applications
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SPTS's Omega Plasma Etch System Chosen by Hiwafer for New 6'' GaN-on-SiC High-Power RF Device Production Line
Nov 28, 2017SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won an ...
Tags: SPTS, GaN-on-SiC, LED
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Wolfspeed Extends 50V GaN Hemt Family to High-Efficiency 3.0GHz 250W
Aug 28, 2017Wolfspeed of Raleigh, NC, USA — a Cree Company that makes silicon carbide (SiC) power products and GaN-on-SiC high-electron-mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs) — has extended its ...
Tags: Wolfspeed, silicon carbide
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Carbonics Introduces Carbon-on-Silicon Wafers for RF Components in 5G Wireless
Apr 7, 2017Carbonics Inc of Marina Del Rey, CA, USA has launched its ZEBRA carbon-on-silicon technology for radio frequency (RF) components and devices in wireless, communications, defense and aerospace markets. Carbonics was spun out from ...
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MACOM Showcasing Dc-100ghz MMICs atEuMW
Sep 9, 2016In booth #207 at European Microwave Week (EuMW 2016) at ExCel London, UK (4–6 October), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, ...
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Kyma and Quora Partner on GaN Substrate Materials
Jun 23, 2016Kyma Technologies Inc of Raleigh, NC, USA (which provides crystalline nitride materials, crystal growth and fabrication equipment, and power switching electronics) and Quora Technology Inc have announced a strategic partnership in the ...
Tags: Kyma technologies, GaN, Quora
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RJR Ships 10 Millionth Air-Cavity Plastic Package, Highlighting Migration From Air-Cavity Ceramic Packaging for RF
May 20, 2016RJR Technologies Inc of Oakland, CA, USA, a developer and high-volume manufacturer of air-cavity plastic (ACP) semiconductor packaging for RF and microwave markets, has shipped over 10 million ACP packages, reflecting the increasing use of ...
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US Air Force Offering $13.5m Cooperative Agreement to Develop Large-Diameter SiC Substrates
Apr 6, 2016The US Department of Defense's Air Force Research Laboratory, Sensors Directorate, Devices for Sensing Branch (AFRL/RYDD) has issued a Request For Information (RFI) titled 'Development of Large Diameter Silicon Carbide Substrate and ...
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EVG Sees Power Device and RF Applications Driving Demand for Wafer Bonding Solutions for Engineered Substrates
Dec 21, 2015EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...
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San'an IC Selects Mentor Graphics' Calibre Platform for Verification of GaAs Wireless ICs
Dec 2, 2015Electronic hardware and software design solutions provider Mentor Graphics Corp of Wilsonville, OR, USA says that Xiamen San'an Integrated Circuit Co Ltd (San'an IC) of Xiamen Torch High-tech Industrial Development Zone, China has selected ...
Tags: San'an, Mentor Graphics, GaAs
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TowerJazz Panasonic Develops 65nm Mmwave 110GHz RF-CMOS Platform
Sep 29, 2015Specialty foundry TowerJazz (which has fabrication plants at Tower Semiconductor Ltd in Migdal Haemek, Israel, and at its subsidiaries Jazz Semiconductor Inc in Newport Beach, CA, USA and TowerJazz Japan Ltd) together with analog foundry ...
Tags: Panasonic, CMOS, Semiconductor, wireless communication, automotive radar
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MACOM Ships Millionth GaN-on-Si RF Power Device
Sep 11, 2015M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has now shipped more than 1 million gallium nitride on ...
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The New Supply Contract Between IQE's Wireless Business Unit and Major Tier-1 Customer
Jan 20, 2015Epiwafer foundry and substrate maker IQE plc of Cardiff, Wales, UK has concluded the renegotiation of a long-term supply contract with an existing tier-1 customer for the supply of wafer products used in wireless applications. The new ...
Tags: wireless applications, long-term customer relationship, Electrical
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A Good Dielectric Material Being an Effective Supporter of Electrostatic Fields
Jan 20, 2015Morgan Advanced Materials (MGAM) announces its extensive range of ceramic capacitorsThe main differences between ceramic dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit ...
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NRL Has Received The Japan Society of Applied Physics' 2014 Outstanding Paper Award
Sep 23, 2014An interdisciplinary team at the US Naval Research Laboratory (NRL) has received the Japan Society of Applied Physics’ 2014 Outstanding Paper Award. The award is only given to a select group of papers that present excellent ...
Tags: NRL, Award, Electronics
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Agilent Announces Innovations of Its Suite of Device Modeling and Software Tools
Jul 7, 2014Agilent Technologies Inc of Santa Clara, CA, USA has announced several innovations for the 2014 release of its suite of device modeling and characterization software tools. The suite comprises the Integrated Circuits Characterization and ...
Tags: GaN HEMTs, 3D Finfets
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