Substrate articles & resources on Made-in-China.com

Sanan IC Extends III-V Foundry From Greater China to North American, European and APAC Markets

Aug 27, 2018

Sanan Integrated Circuit Co Ltd (Sanan IC) of Xiamen City, Fujian province (China’s first 6-inch pure-play compound semiconductor wafer foundry) has announced its entry into the North American, European and Asia Pacific (APAC) markets ...

Tags: integrated passive device, filters

pSemi Launches First Monolithic SOI Wi-Fi Front-End Module

Aug 20, 2018

Murata company pSemi Corp of San Diego, CA, USA (formerly Peregrine Semiconductor Corp) – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has introduced what it clams is ...

Tags: Peregrine Semiconductor, integrated circuit

DuPont Safety & Construction Plans to Invest Over $400m to Increase Tyvek Capacity

Jun 11, 2018

DowDuPont Specialty Products Division business unit, DuPont Safety & Construction, is planning to invest more than $400m to expand the manufacture of Tyvek nonwoven materials at its Luxembourg facility. The production expansion, which ...

Tags: DuPont, nonwoven material

Clipper Teas Plans to Use Plastic-Free Tea Bags by Summer 2018

Apr 27, 2018

Clipper Teas, the tea brand owned by natural and organic food company Wessanen UK, has committed to use fully biodegradable tea bag by summer 2018. The company has completed two initial trials on a new substrate, an alternative which is ...

Tags: Clipper, organic food

BOBST Launches New 20seven CI Flexo Press for Flexible Packaging Industry

Apr 12, 2018

BOBST has launched the new 20SEVEN CI flexo press to deliver Extended Color Gamut (ECG) solutions for a variety of printing technologies and applications. BOBST Business Unit Web-fed strategic products marketing director Federico ...

Tags: BOBST, Flexo Press, Flexible Packaging

South Africa's First Impression Labels Invests in Screen and Rotocon Equipment

Apr 8, 2018

South African label printer and converter First Impression Labels (FIL) has purchased equipment from Rotocon and Screen Graphic Solutions to boost its digital print production capability. The firm has invested in a Screen Truepress Jet ...

Tags: Screen Equipment, Rotocon Equipment

Greek Label Printer ETPA Packaging Installs Gallus ECS 340 Press

Mar 21, 2018

ETPA Packaging, a Greece-based label printer, has installed a Gallus ECS 340 machine at its production site in Komotini, North Eastern Greece. Established in 1983, the Greek label printer is focused supplying self-adhesive labels, shrink ...

Tags: Label Printer, Packaging

ProAmpac Secures Four Flexible Packaging Association Awards

Mar 19, 2018

The Flexible Packaging Association presented ProAmpac two gold and two silver annual achievement awards for packages showcasing innovation and advances in packaging. The awards were announced last night at the FPA Welcome Dinner & ...

Tags: ProAmpac, Flexible Packaging

Uflex Produces First Glitter Printing Rotogravure Cylinder in India

Mar 7, 2018

Uflex is the first Indian company to manufacture glitter printing rotogravure cylinder on its state-of-the-art direct laser engraving line. Pigments of glitter inks are substantially bigger in size as compared to conventional gravure inks ...

Tags: Uflex, Rotogravure Cylinder, LED lamps

Air Products to Launch New Flux-Free Soldering Technology for Wafer Level Packaging Applications

Feb 22, 2018

Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...

Tags: Air Products, Wafer Level Packaging

DSM Introduces New Feel Experience for Graphic and Packaging Design Via Skins

Jan 23, 2018

DSM has announces the latest addition to its coating resins portfolio Skins by DSM. A special series of resins that enhances a key element for graphic and packaging design; touch. The resins, launched via the characters Rubbert Skins, ...

Tags: graphic design, resins

XRite eXact Family Supports Latest ISO 20654 Standard for SCTV

Dec 21, 2017

X-Rite’s eXact family of handheld spectrophotometers is now supporting new ISO standard for Spot Color Tone Value (SCTV). eXact allows printers and packaging converters to understand, control, manage, and communicate color through ...

Tags: ISO standard, spectrophotometers

Comexi, Quadtech Collaborate on Closed-Loop Color Control for Flexible Packaging

Dec 8, 2017

Comexi and QuadTech have joined forces in the investigation and development of new color control management technologies for the flexible packaging industry since 2016. After years of research, this close collaboration between the two ...

Tags: Comexi, Flexible Packaging

Lasertec Launches GALOIS GaN Wafer Inspection and Review System

Dec 7, 2017

Metrology and inspection equipment maker Lasertec Corp of Tokyo, Japan has launched the GALOIS defect inspection and review system series, designed specifically for the inspection and analysis of gallium nitride (GaN) wafers. The firm is ...

Tags: Metrology, inspection equipment

Mitsui, Bilcare Introduce New Heat Seal Coating for Pharma Blister Packaging in India

Nov 22, 2017

Mitsui Chemicals, along with Bilcare, has introduced new Chemipearl XSP water-based heat seal coating for pharmaceutical blister packaging in India. Mitsui developed XSP series of Chemipearl, which serve as an alternative to existing ...

Tags: Blister Packaging

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