WLP articles & resources on Made-in-China.com

Kulicke & Soffa Launches Wafer Dicing Solution For Advanced Packaging

Mar 21, 2016

Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...

Tags: KulickeSoffa, FCC Hub Blades, AccuPlus series

Veeco Wins Advanced Packaging System Orders From Asian Foundry

Dec 25, 2015

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system (a platform that provides ...

Tags: Veeco Wet processing, Veeco Instruments Inc, Electronics

Veeco Wins Multiple Advanced Packaging System Orders in Asia

Dec 25, 2015

Veeco Instruments has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. ...

Tags: Veeco Instruments, Fan-out Wafer Level Packaging, Packaging

Ultratech Receives Large Multiple System Order for Fan-out Wafer-Level Packaging Application

Oct 21, 2015

Ultratech, a supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has ...

Tags: Wafer-Level Packaging, LEDs

Taiwan's AWSC Purchases Classone's Solstice S8 Electroplater

Apr 7, 2015

ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment (especially for cost-conscious emerging markets and users of smaller substrates), has delivered a fully automated Solstice S8 electroplating ...

Tags: AWSC, MMIC, Electrical

Yole Développement Has Released a New Study 'permanent Wafer Bonding for Semiconductor

Apr 24, 2014

With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...

Tags: Electrical, Electronics

Obamacare Customers Given More Time to Pay Insurers

Jan 13, 2014

The relaxed timetables reflect efforts by the insurance industry, as well as the Obama administration, to "coax" people towards "cementing" their 2014 coverage, reports Bloomberg News. In addition, a Commonwealth survey finds more people ...

Tags: Premium Payment, Insurers Extend Premium Payment Deadlines

Global Semiconductor Capex on Manufacturing Equipment Declined 16.1% During 2012

Apr 24, 2013

Back-end segment and the wafer-level packaging (WLP)-related segments ruled the semiconductor market during the year Global semiconductor capex on manufacturing equipment declined 16.1% during 2012 to $37.8bn compared to 2011, according ...

Tags: Semiconductor Manufacturing, Consumer Electronics

WLP Has named Joseph Swedish as The Company's New Chief Executive Officer Effective

Feb 18, 2013

US-based health insurer WellPoint (WLP) has named Joseph Swedish as the company's new chief executive officer effective from 25 March 2013. Swedish, who replaces interim chief executive officer John Cannon, joins WLP from Trinity Health ...

Tags: WellPoint, health insurer, new CEO

WLP Has Closed The Acquisition of Amerigroup

Dec 27, 2012

US-based health insurer WellPoint (WLP) has closed the acquisition of Amerigroup, in a bid to effectively serve the growing Medicaid population in the country. The acquirer expects the acquisition of Amerigroup to boost its core business ...

Tags: WLP, health insurer, acquisition, Amerigroup

WLP Chair and Chief Executive Angela Braly Has Stepped Down From Her Post

Aug 30, 2012

Health insurer WellPoint (WLP) chair and chief executive Angela Braly has stepped down from her post. The company has appointed John Cannon, the company's executive vice president, general counsel, corporate secretary and chief public ...

Tags: health insurer, chief executive, stepped down, insurance

Polymeric Semiconductor Material Market Was Valued at $274 Million

May 29, 2012

A new report estimates that the compound annual growth rate (CAGR) of polymer usage will increase by 26% in wafer level applications over the next 5 years. Last year, polymeric semiconductor material market was valued at $274 million, ...

Tags: Polymeric Materials, Polymer

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