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Flip-Chip Hybrid External-Cavity Laser Array on Silicon Platform
Oct 8, 2016Oracle Networking Group in the USA believes that it has made the first demonstration of an integrated surface-normal coupled laser array on a silicon-on-insulator photonics platform [Shiyun Lin et al, Optics Express, vol24, p21455, 2016]. ...
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Nationstar Signs Two Equipment Procurement Contracts Totaling RMB 150M
Dec 15, 2015Nationstar announced it signed two separate procurement agreements with ASM Microelectronics Technical Services (Shanghai) (ASM Microelectronics) and ASM Pacific (Hong Kong Limited). According to the company statement, the agreement ...
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Mitsubishi Launches Bonding Services Using Proprietary Room-Temperature Wafer Bonding Systems
Aug 12, 2014In respondse to external demand, Tokyo-based machinery manufacturer Mitsubishi Heavy Industries Ltd (MHI) has launched wafer bonding services using its wafer bonding systems, which have been developed in-house and are capable of bonding ...
Tags: Electrical, Electronics, machinery
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MHI Has Developed The World's First Fully Automated 12-Inch Wafer Bonding Machine
Feb 22, 2012Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST, " capable of producing 3-dimensionally integrated LSI (large-scale ...
Tags: industry trends, bonding machine
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