device manufacturers articles & resources on Made-in-China.com

Domino Printing Sciences, PAC Machinery Partner for Medical Device Packaging Solution

Apr 10, 2018

PAC Machinery has partnered with Domino Printing Sciences to develop printing capabilities that deliver consistent and quality serialized codes on medical device packaging that will meet strict Food and Drug Administration standards for ...

Tags: Domino Printing, PAC Machinery, Medical Device

PEIC Panelists to Address Perspectives on Workforce Challenges & Opportunities Facing Power Electronics Industry

Sep 11, 2017

As part of the Special Session program at the IEEE Energy Conversion Congress & Expo (ECCE 2017) in Cincinnati, OH (1–5 October), the Power Electronics Industry Collaborative (PEIC) – a national, industry-focused member-based ...

Tags: semiconductor, supply chain

Picosun Reports Repeat Sales of P-300BV Vacuum Batch Production Tools for 200mm Applications

Sep 4, 2017

Atomic layer deposition (ALD) thin-film technology firm Picosun Oy of Espoo, Finland has reported repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. Even if the 300mm wafer size ...

Tags: LED lighting, MEMS

3M Introduces New Acrylic-Based Adhesive Solution for Medical Device Industry

Aug 23, 2017

US-based firm 3M has introduced new long-term wear and acrylic-based adhesive solution for the medical device industry. The company has launched 4076 extended wear medical tape, which is an advanced adhesive solution for medical device ...

Tags: Medical Device, 3M

Brewer Science, Arkema Partner to Develop High-Chi DSA Materials for Advanced Node Patterning

Jul 17, 2017

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers. Brewer Science indicated these new materials target ...

Tags: Brewer Science, Node Patterning

Rudolph Secures Multiple Orders for Firefly Inspection System

May 3, 2017

Rudolph Technologies has secured multiple orders from two advanced packaging service suppliers for its Firefly inspection systems. The system helps manufacturers in identifying defects earlier in the process, improving reliability of ...

Tags: advanced packaging, semiconductor

Carbonics Introduces Carbon-on-Silicon Wafers for RF Components in 5G Wireless

Apr 7, 2017

Carbonics Inc of Marina Del Rey, CA, USA has launched its ZEBRA carbon-on-silicon technology for radio frequency (RF) components and devices in wireless, communications, defense and aerospace markets. Carbonics was spun out from ...

Tags: Carbonics, Carbon-on-Silicon Wafers

Pro Mach Showcases Packaging Machines at Pack Expo 2016

Nov 11, 2016

Pro Mach, a provider of integrated packaging and processing products and solutions for food, beverage, consumer goods, pharmaceutical, and other diverse companies, will field the largest collection of packaging machines at Pack Expo 2016. ...

Tags: Pro Mach, integrated packaging

Brenton to Debut Advanced Medical Devices Packaging System at Pack Expo 2016

Oct 26, 2016

Brenton Engineering, powered by Pro Mach, plans to introduce a new integrated primary and secondary medical device packaging system at the Pack Expo event scheduled to be held in from 6-9 November in Chicago, US. The new packaging system ...

Tags: Brenton, Medical Devices, Packaging

Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology

Oct 13, 2016

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has begun mass production of the Exynos 7 Dual 7270. It is the first mobile application processor (AP) in the industry designed ...

Tags: Exynos 7 Dual 7270, mass production

Samsung Mass Producing Industry's First 512-Gigabyte NVMe SSD in a Single BGA Package for More Flexibility in Computing Device Design

Sep 29, 2016

Samsung Electronics, the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe solid state drive (SSD) in a single ball grid array (BGA) package, for use in ...

Tags: Samsung, 512-Gigabyte NVMe SSD, single BGA package

Taiwan's Export Orders Continue Declining in June, But Show Signs to Turn Around Soon

Jul 28, 2016

Taiwan’s export orders in June continued dropping, but having showed positive signs to turn around soon. After a 15-month declining streak as of the end of June, Taiwan's overall export orders are likely to show growth in July at ...

Tags: Taiwan's export orders, electronic parts

II-VI Purchases Lasertec SICA88 Inspection Analysis Tool for SiC Substrate Manufacturing

Jul 19, 2016

II-VI Inc of Saxonburg, PA, USA says that the Advanced Materials Division of its Performance Products Segment in Pine Brook, NJ, has purchased a SICA88 SiC inspection & analysis tool made by the Lasertec Corp of Tokyo, Japan, for ...

Tags: SiC Substrate

EV Group Unveils Automated Metrology System for Advanced Packaging

Jul 19, 2016

EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG50 automated metrology system. Designed to support the increasingly stringent manufacturing ...

Tags: Advanced Packaging, EV Group

Kyma and Quora Partner on GaN Substrate Materials

Jun 23, 2016

Kyma Technologies Inc of Raleigh, NC, USA (which provides crystalline nitride materials, crystal growth and fabrication equipment, and power switching electronics) and Quora Technology Inc have announced a strategic partnership in the ...

Tags: Kyma technologies, GaN, Quora

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