Sanan Integrated Circuit Co Ltd (Sanan IC) of Xiamen City, Fujian province (China’s first 6-inch pure-play compound semiconductor wafer foundry) has announced its entry into the North American, European and Asia Pacific (APAC) markets ...
Tags: integrated passive device, filters
Murata company pSemi Corp of San Diego, CA, USA (formerly Peregrine Semiconductor Corp) – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has introduced what it clams is ...
DowDuPont Specialty Products Division business unit, DuPont Safety & Construction, is planning to invest more than $400m to expand the manufacture of Tyvek nonwoven materials at its Luxembourg facility. The production expansion, which ...
Tags: DuPont, nonwoven material
Clipper Teas, the tea brand owned by natural and organic food company Wessanen UK, has committed to use fully biodegradable tea bag by summer 2018. The company has completed two initial trials on a new substrate, an alternative which is ...
Tags: Clipper, organic food
BOBST has launched the new 20SEVEN CI flexo press to deliver Extended Color Gamut (ECG) solutions for a variety of printing technologies and applications. BOBST Business Unit Web-fed strategic products marketing director Federico ...
Tags: BOBST, Flexo Press, Flexible Packaging
South African label printer and converter First Impression Labels (FIL) has purchased equipment from Rotocon and Screen Graphic Solutions to boost its digital print production capability. The firm has invested in a Screen Truepress Jet ...
ETPA Packaging, a Greece-based label printer, has installed a Gallus ECS 340 machine at its production site in Komotini, North Eastern Greece. Established in 1983, the Greek label printer is focused supplying self-adhesive labels, shrink ...
Tags: Label Printer, Packaging
The Flexible Packaging Association presented ProAmpac two gold and two silver annual achievement awards for packages showcasing innovation and advances in packaging. The awards were announced last night at the FPA Welcome Dinner & ...
Tags: ProAmpac, Flexible Packaging
Uflex is the first Indian company to manufacture glitter printing rotogravure cylinder on its state-of-the-art direct laser engraving line. Pigments of glitter inks are substantially bigger in size as compared to conventional gravure inks ...
Tags: Uflex, Rotogravure Cylinder, LED lamps
Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...
DSM has announces the latest addition to its coating resins portfolio Skins by DSM. A special series of resins that enhances a key element for graphic and packaging design; touch. The resins, launched via the characters Rubbert Skins, ...
Tags: graphic design, resins
X-Rite’s eXact family of handheld spectrophotometers is now supporting new ISO standard for Spot Color Tone Value (SCTV). eXact allows printers and packaging converters to understand, control, manage, and communicate color through ...
Tags: ISO standard, spectrophotometers
Comexi and QuadTech have joined forces in the investigation and development of new color control management technologies for the flexible packaging industry since 2016. After years of research, this close collaboration between the two ...
Tags: Comexi, Flexible Packaging
Metrology and inspection equipment maker Lasertec Corp of Tokyo, Japan has launched the GALOIS defect inspection and review system series, designed specifically for the inspection and analysis of gallium nitride (GaN) wafers. The firm is ...
Tags: Metrology, inspection equipment
Mitsui Chemicals, along with Bilcare, has introduced new Chemipearl XSP water-based heat seal coating for pharmaceutical blister packaging in India. Mitsui developed XSP series of Chemipearl, which serve as an alternative to existing ...
Tags: Blister Packaging