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HP Unveils Two Pagewide Ultra High-Volume Inkjet Web Presses

May 21, 2018

HP introduced two new six-color PageWide ultra high-volume inkjet web presses for pre-print digital corrugated printing. The new presses, HP PageWide T1190 and HP PageWide T1170, are designed to help packaging converters meet ...

Tags: Inkjet Web Presses, HP

NREL Makes Available Database of Inorganic Thin-Film Materials

Apr 8, 2018

An extensive experimental database of inorganic thin-film materials that organizes a decade’s worth of research at the Department of Energy’s National Renewable Energy Laboratory (NREL) is now publicly available (‘An open ...

Tags: Thin-film, PV, Thin-Film Materials

Magna Forms Composite Liftgate JV with Chinese Automaker

Apr 4, 2018

Automotive parts supplier Magna International formed a joint venture (JV) in China to make composite liftgates for a global automaker’s crossover vehicle commencing in late 2018. The JV with Guangzhou Automobile Group (GAC) ...

Tags: Magna, Chinese Automaker

EFI Showcases Corrugated Packaging Technologies at Icorrugated Asia Expo in China

Mar 26, 2018

Electronics For Imaging (EFI) is exhibiting its corrugated packaging technologies at this year’s iCorrugated Asia Expo in Shanghai, China, which is being held between 21 March and 23 March. At the event, the company is showcasing ...

Tags: corrugated packaging, Electronics

Baker Perkins Develops New Feed System for Powder Coating and Industrial Extruders

Feb 24, 2018

Baker Perkins said its new MAX3 feed system for powder coating and industrial extruders can result in a throughput increase of up to 34%. Baker Perkins had added MAX³ with re-designed feed port and screws to enhance flow of material ...

Tags: Baker Perkins, Powder Coating, Industrial Extruders

Chocolate Factory Overcomes Machinery Downtime by Replacing Metal Parts with Stratasys Composite 3D Printing Material

Jan 15, 2018

Stratasys said that Dutch 3D service bureau, Visual First, is using FDM Nylon 12CF carbon-filled thermoplastic to replace metal machine parts for its customer, The Chocolate Factory. The ability to 3D print machinery replacement parts ...

Tags: 3D Printing Material, Chocolate

Lasertec Launches GALOIS GaN Wafer Inspection and Review System

Dec 7, 2017

Metrology and inspection equipment maker Lasertec Corp of Tokyo, Japan has launched the GALOIS defect inspection and review system series, designed specifically for the inspection and analysis of gallium nitride (GaN) wafers. The firm is ...

Tags: Metrology, inspection equipment

ROHM Supplying Full-SiC Power Modules to Venturi Formula E Racing Team

Dec 5, 2017

ROHM of Kyoto, Japan is to provide full-SiC (silicon carbide) power modules to the VENTURI Formula E team during season 4 (2017–2018) of FIA Formula E (the world’s first formula racing championship for all-electric vehicles), ...

Tags: Power Modules, silicon carbide

Changelight Orders Further Aixtron AIX 2800G4-TM MOCVD Systems to Expand Roy LED Capacity

Nov 30, 2017

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple AIX 2800G4-TM MOCVD cluster tools from Chinese optoelectronic manufacturer Xiamen Changelight Co Ltd to expand its production ...

Tags: LED Capacity, cluster tools

US-Based NGS Printing Invests in Second ZND D3 L-3200 Cutting System

Nov 27, 2017

US-based NGS Printing has invested in a new D3 L-3200 cutting system from Zund, a developer, manufacturer, and distributor of multi-functional digital cutters. The Zünd D3 L-3200, which is the second cutting system to be installed by ...

Tags: NGS Printing, cutting system, digital cutters

Tonejet Unveils New Direct-to-Can Digital Printing Machine at Inprint

Nov 22, 2017

Tonejet has unveiled its first industrial production direct-to-can digital printing machine at InPrint 2017 in Germany. The Tonejet Cyclone machine is said to combine various patented technologies and eliminates long lead times and ...

Tags: Tonejet, Digital Printing Machine

ClassOne Slashes Via Liner Plating Costs for Compound Semiconductors

Nov 22, 2017

ClassOne Technology of Kalispell, MT, USA (which manufactures Solstice electroplating systems for ≤200mm wafers), has unveiled a new plating technique that is said to provide significant cost reductions for compound semiconductor ...

Tags: Compound Semiconductors

Sun Automation Launches New Print Unit for Inside Printing of Corrugated Box

Nov 8, 2017

Corrugated packaging solutions provider Sun Automation Group has introduced new print unit for inside printing of the corrugated box. The new Sun spectrum print unit is said to enable customers to single pass print on both sides of a ...

Tags: Corrugated Box, Printing

Skyworks Unveils New Skyone Wifi Family of Front-End Modules

Oct 31, 2017

Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) has introduced a new family of highly integrated wireless networking solutions for mobile and Internet of Things (IoT) ecosystems. The ...

Tags: Skyworks, Front-End Modules

Heidelberger Launches New Rotary Die-Cutter for in-Mould Label Market

Oct 30, 2017

Heidelberger Druckmaschinen has introduced new Speedmaster XL 106-DD rotary die-cutter for the in-mould label market. The new rotary die-cutter, which is based on XL technology, can be used for the production of in-mould labels and other ...

Tags: Heidelberger, label market

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