LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has announced its P-Series of high-power LED flip-chip/chip-on-board (COB) products.
The high-performance lighting modules consist of patented 3-Pad LED flip chips with a Pillar Metal Core printed circuit board (P-MCPCB) to reduce module thermal resistance, resulting in lower junction temperature, lower thermal decay and the feasibility of smaller light-emitting surface (LES). The firm says that this enables designers to enhance 'lumen-per-dollar' performance by either driving the modules at higher currents for more light output, or shrinking the heat-sinks and optics dimensions, or reducing LED chip counts.
The high-power P-Series COBs feature 45mil x45mil 3-Pad LED flip chips and high flux density in a small LES. The models P110-12S8P (96 chips), P110-15S12P (180 chips) and P110-15S19P (285 chips) support 'boost' power at 300W, 600W and 960W with LES of 45mm, 60mm and 85mm, respectively. Their high lumen-per-dollar value and extremely low thermal resistances (0.01°C/W, 0.008°C/W and 0.007°C/W) make the COB solutions suitable for replacing high-intensity discharge (HID) luminaires in stadium, sport complex, wharf, storage, airport, golf course, farmland and architectural display applications.
All three models are available for sample purchase. OEM quantities are subject to delivery with standard lead times of 4 weeks.
Flip Chip Opto is demonstrating its products in booth 629 at the Strategies in Light 2015 event in Las Vegas (24-26 February).
