EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...
CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon ...
Tags: Leti, Silicon Photonics
Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and its partners say that they have built three silicon photonics platforms, as they reach the mid-point of the four-year European Union Seventh Framework Program (EU FP7) project ...
Tags: Leti, silicon photonics, STMicroelectronics
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference--a leading ...
SüSS MicroTec AG of Garching, near Munich, Germany, a supplier of equipment and process solutions for microstructuring in semiconductor and related markets, has launched the XB8 bonding platform. Designed for a wide range of bonding ...
Tags: SüSS MicroTec, Wafer bonding, semiconductor
Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) have launched a program in ...
The National Renewable Energy Laboratory (NREL) and University of California Santa Barbara in the USA have developed a wafer bonding technology for III-V materials and silicon (Si) using transparent conductive oxide (TCO) interlayers of ...
Tags: electronic components, semiconductor, TCO IZO Tandem solar cells
For a third consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards from VLSIresearch Inc's annual ...
Tags: EV Group, lithography equipment
EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has unveiled the HERCULES NIL — a fully integrated track system that combines cleaning, ...
Korea Institute of Science and Technology has presented what it says is the first demonstration of indium gallium arsenide on-insulator (In0.53Ga0.47As-OI) transistors with a buried yttrium oxide (Y2O3 BOX) layer [SangHyeon Kim et al, IEEE ...
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has introduced two new configurations to its EVG580 ComBond series of automated ...
Tags: EV Group, wafer bonding systems
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has established the NILPhotonics Competence Center, which is designed to assist customers ...
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for silicon photonics, according to the ‘Silicon Photonics 2014’ report from Yole Développement. ...
Tags: Silicon Photonics
The Fraunhofer Institute for Solar Energy Systems ISE in Freiburg, Germany has achieved record photovoltaic (PV) solar module efficiency of 36.7%, as measured under Concentrator Standard Testing Conditions (CSTC). This has been done by ...
Tags: PV Module, Solar Energy Systems
In respondse to external demand, Tokyo-based machinery manufacturer Mitsubishi Heavy Industries Ltd (MHI) has launched wafer bonding services using its wafer bonding systems, which have been developed in-house and are capable of bonding ...
Tags: Electrical, Electronics, machinery