Germany-based semiconductor equipment firm Suss MicroTec and Georgia Institute of Technology (Georgia Tech) have joined hands for conducting research on nanotechnology, bio-medical and semiconductor 3D packaging. Under the arrangement, a ...
Tags: Suss Microtec, 3D Packaging
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has introduced two new configurations to its EVG580 ComBond series of automated ...
Tags: EV Group, wafer bonding systems
Researchers at Chinese Academy of Sciences’ Institute of Semiconductors have achieved a 42% enhancement in light output from flip-chip indium gallium nitride (InGaN) light-emitting diodes (LEDs) by incorporating a photonic crystal ...
Tags: photonic crystal(PHC)structure, light-emitting diodes, Electrical
Following its Manufacturing Advanced Functional Materials (MAFuMa) call issued in February, the UK’s Engineering and Physical Sciences Research Council (EPSRC) has awarded £20m to 10 new research projects that aim to advance the ...
Tags: Functional Materials, Electronics
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has established the NILPhotonics Competence Center, which is designed to assist customers ...
Rudolph Technologies Inc of Flanders, NJ, USA, which provides defect inspection, packaging lithography, process control metrology and data analysis systems and software, has received multi-system orders from several customers for its latest ...
Process control and yield management solutions provider KLA-Tencor Corp of Milpitas, CA, USA has introduced the WaferSight PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system, and the ...
Tags: KLA-Tencor, process control loops
IBM is investing $3bn over the next 5 years in two broad research and early-stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and ‘big data’ systems. The ...
Tags: IBM, Big-Data Systems
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has shipped an EVG510 semi-automated wafer bonding system and an EVG620 automated bond ...
Tags: EV Group, wafer bonding system
According to Yole Développement's new market research report 'LED Front-End Manufacturing Trends' (which covers substrates, epitaxy, lithography, plasma etching & deposition, PVD and testing), the LED substrate is one of the key ...
Tags: LED, Electrical, Electronics
Global market for industrial laser systems worth $10.7BN in 2013, says Optech’s Arnold Mayer. Respected industrial laser market forecaster Arnold Mayer says that the global market for laser materials processing systems hit a record ...
IBM Research's Thomas J. Watson Research Center and Northwestern University have developed a technique to grow hexagonal- and cubic-phase gallium nitride (h-/c-GaN) on standard (100) silicon (Si) [Can Bayram et al, Adv. Funct. Mater., ...
Obducat AB of Lund, Sweden, a developer and supplier of technologies, products and processes based on proprietary nanoimprint lithography (NIL), has launched the second-generation SINDRE system which, due to improved performance, will be ...
Tags: Obducat Lithography, Electrical, Electronics
Driven by the fanfare over (and over-estimation of) the LCD display market, the LED front-end equipment market experienced an unprecedented investment cycle in 2010-2011, driven mostly by metal-organic chemical vapor deposition (MOCVD) ...
Tags: LED, Electrical, Electronics
RoHS directive to exclude the contents of the original February 12, 2003 e Applications of lead, mercury, cadmium and hexavalent chromium, which are exempted from the requirements of Article 4(1) 1. Mercury in compact fluorescent ...
Tags: RoHS certification, certification, RoHS