Electronics for Imaging (EFI) has introduced new version of Fiery XB digital front end (DFE) platform for ultra-high-speed production inkjet presses. EFI Fiery XB platform for the new DFE complies with native intelligent production data ...
Tags: inkjet presses, inkjet
ClassOne Technology of Kalispell, MT, USA (which manufactures Solstice electroplating systems for ≤200mm wafers), has unveiled a new plating technique that is said to provide significant cost reductions for compound semiconductor ...
Tags: Compound Semiconductors
Held annually at Sands Expo in Las Vegas, the U.S., AAPEX (Automotive Aftermarket Products Expo) has ended another successful year and unveiled future trends of the continuously growing auto aftermarket and car servicing industries through ...
Tags: AAPEX 2017, Automotive Aftermarket
AKHAN Semiconductor Inc of Gurnee, IL, USA, which specializes in the fabrication and application of lab-grown, electronics-grade diamond, says that the Japan Patent Office has issued it patent JP6195831 (B2) covering a method for the ...
Working with scientists in Texas and Warsaw, researchers at Finland’s Aalto University have made a breakthrough in revising methods largely discarded 15 years ago (‘Amphoteric Be in GaN: Experimental Evidence for Switching ...
Tags: GaN Power electronics
Goya Foods, a Hispanic-owned food company in the US, has expanded its North American Processing Center in Brookshire, Texas with the addition of 324,000ft2 of production warehouse, distribution warehouse, auxiliary buildings and production ...
Tags: Goya Foods, HVAC system
Little Rapids, a US-based specialty paper manufacturer, has commissioned a new Voith Paper-built XcelLine VTM 3 tissue machine at its manufacturing facility in Wisconsin. The new Voith machine been designed to replace the existing PM3 ...
Tags: PM3 machine, Tissue Machine
UK-based packaging solutions provider Easypack has introduced advanced high-speed void fill packaging system with new patented technology. The new Quantum XT is a fast void fill solution, which enables users to firmly receive goods inside ...
Tags: Fill Packaging System, packaging
Packaging products manufacturer Starlinger has inaugurated the new headquarters of its recycling technology division in Austria. Located in Weissenbach, Lower Austria, the new facility will take over Starlinger’s recycling ...
Tags: Starlinger, Packaging
Mercedes-Benz said that it will start series production of a city bus with all-electric drive system based on the international best-seller, the Mercedes-Benz Citaro. "Our city bus produces zero local emissions and is ultra-quiet through ...
Tags: Mercedes-Benz, City Bus
Sun Chemical has introduced two new UV/EB inks for primary and secondary food packaging applications. The new inks, which are compliant with current global standards, can also meet Nestlé food packaging requirements and Swiss ...
Tags: Sun Chemical, Food Packaging
For third-fiscal 2017, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $131.9m, up 15% on $115.1m last quarter and up 54% on $85.5m a year ago, marking the first full ...
Tags: LED market, LED Lighting
Groupe Renault has debuted what it claims to be the world’s first in autonomous obstacle avoidance that matches professional test drivers. Renault Open Innovation Lab, which is based in Silicon Valley, developed the new feature for ...
Tags: Autonomous Cars, Renault
Advantech Wireless Inc of Montreal, Canada (which manufactures satellite, RF equipment and microwave broadband communications systems) is presenting details of its second-generation gallium nitride (GaN)-based solid-state power amplifiers ...
Tags: Advantech Wireless, GaN technology
Corrugated packaging solutions provider Sun Automation Group has introduced new print unit for inside printing of the corrugated box. The new Sun spectrum print unit is said to enable customers to single pass print on both sides of a ...
Tags: Corrugated Box, Printing