Electron Beam articles & resources on Made-in-China.com

NASA Studies Space Applications for GaN Crystals

Aug 20, 2018

Two teams at the US National Aeronautics and Space Administration (NASA) Goddard Space Flight Center in Greenbelt, MD, USA are being funded to investigate the use of gallium nitride (GaN) to enhance space exploration. Engineer Jean-Marie ...

Tags: GaN transistors, GaN Crystal

Sun Chemical to Increase Prices on Energy Curable Inks

Jun 19, 2018

Sun Chemical will increase the prices of all ultraviolet (UV) and electron beam (EB) inks in Europe between 4% and 6%, effective 1 July, 2018. As announced previously, governmental initiatives and regulations geared toward environmental ...

Tags: Sun Chemical, Energy Curable Inks

Sun Chemical Introduces New UV Ink System for Food Packaging Applications

Feb 28, 2018

Sun Chemical, a subsidiary of DIC group, has introduced new UV ink system for primary and secondary food packaging applications. The ink system, dubbed SunCure Accuflex UV, is for several food applications that are not manufactured with ...

Tags: Sun Chemical, UV Ink System, Food Packaging

Sun Chemical Introduces New UV/EB Inks for Food Packaging Applications

Nov 13, 2017

Sun Chemical has introduced two new UV/EB inks for primary and secondary food packaging applications. The new inks, which are compliant with current global standards, can also meet Nestlé food packaging requirements and Swiss ...

Tags: Sun Chemical, Food Packaging

Ferrotec Introduces Ferrovac Vacuum Controller to Automate Legacy Manual-Control Deposition Systems

Aug 30, 2017

Ferrotec (USA) Corp, the US subsidiary of materials, component and precision system supplier Ferrotec Holdings Corp of Santa Clara, CA, USA (whose Temescal division of Livermore, CA, USA makes electron-beam evaporative coating systems) has ...

Tags: Ferrotec, operate valve

ZEISS Enters Process Control Market

Jul 12, 2017

ZEISS Group of Oberkochen, Germany is fueling its growth strategy by expanding into the process control market. Through its new Process Control Solutions (PCS) business unit - part of the ZEISS Semiconductor Manufacturing Technology (SMT) ...

Tags: ZEISS, Control Market

ebeam Technologies Adds Inx International to Its Portfolio

May 17, 2017

ebeam Technologies, a developer and manufacturer of electron beam (EB) curing systems, has added inks producer INX International to its portfolio. The companies have formed a partnership, which will boost the development of new ebeam ...

Tags: packaging, digital print

ElifHybr to Develop Hybrid Printing Technology in Turkey

Jan 5, 2017

Elif, the “Global Supplier” of the flexible packaging industry, has been named among the finalists of WorldStar 2017 with the hybrid printing technology ‘ElfHybr’, the latest ring of the chain of innovations made for ...

Tags: ElifHybr, Hybrid Printing

Siegwerk Introduces New Range of Offset Printing Inks for Flexible Packaging

Jan 5, 2017

Printing inks manufacturer, Siegwerk has introduced new ink range for offset printing and subsequent electron beam (EB) curing suitable for flexible packaging. The new ink solution is designed to provide flexible packaging printers with ...

Tags: flexible packaging, printers

Reducing Subthreshold Swing of Gallium Arsenide Transistors

Sep 28, 2016

Korea Institute of Science and Technology (KIST) claims a record low subthreshold swing of 68mV/decade for a gallium arsenide (GaAs) field-effect transistor (FET) [SangHyeon Kim et al, IEEE Electron Device Letters, published online 24 ...

Tags: KIST, GaAs, FET

Gallium Arsenide Phosphide Solar Cells on Silicon with Record 12% Efficiency

Aug 26, 2016

Yale University and University of Illinois Urbana in the USA have improved the efficiency of gallium arsenide phosphide (GaAsP) solar cells on silicon (Si) by reducing threading dislocation densities (TDDs) [Kevin Nay Yaung et al, Appl. ...

Tags: GaAsP solar cells, GaAsP, MBE, MOCVD

Chemical Lift-off of Full-Wafer Gallium Nitride with Zinc Oxide Interlayer

Aug 10, 2016

Researchers based in UK, France, Australia and the USA have developed a chemical epitaxial lift-off (ELO) technique for full 2-inch-diameter gallium nitride (GaN) grown on sapphire and free-standing substrates [Akhil Rajan et al, J. Phys. ...

Tags: GaN, HVPE, free-standing wafers

Onchip Offers Thin-Film Wafer Backside Metallization of Solderable Die-Attach Metal Stacks

Jun 20, 2016

Integrated passive device maker OnChip Devices Inc of Santa Clara, CA, USA says that its wafer fabrication facility is offering backside metallization (BSM) of thin films for applications such as military, medical, and instrumentation. ...

Tags: Sputtering, HB-LEDs, GaN-on-Si, Wafer bonding

Liangdongxin Orders First Temescal UEFC Series Evaporator in China for New GaAs Foundry

May 13, 2016

Materials, component and precision system supplier Ferrotec Corp of Santa Clara, CA, USA (whose Temescal division of Livermore, CA, USA makes electron-beam-based evaporative coating systems) says that a Temescal UEFC series evaporator - the ...

Tags: evaporative coating, Microelectronics

Indium Gallium Arsenide MOSFET Used as Radio-Frequency Switch

Mar 30, 2016

Rearchers in China claim the first radio frequency (RF) switch device based on indium gallium arsenide (InGaAs)-channel metal-oxide-semiconductor field-effect transistor (MOSFET) technology [Zhou Jiahui et al, J. Semicond. 2016, vol37, ...

Tags: InGaAs MOSFET RF switch

Electron Beam

Related Products