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Engineered Substrates
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Three-Year €33m European Project Reference to Extend RF-Soi Technology for Above-1GB/S 4G+ Wireless Front-End Modules
Jul 12, 2016The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
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EVG's Executive Technology Director Paul Lindner Receives European Semi Award
Mar 13, 2016At the SEMI Industry Strategy Symposium Europe 2016 conference in Nice, France (6–8 March), Paul Lindner, executive technology director at EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for ...
Tags: EV Group, Engineered substrates
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EVG Sees Power Device and RF Applications Driving Demand for Wafer Bonding Solutions for Engineered Substrates
Dec 21, 2015EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...
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SOI Wafer Maker Soitec Refutes Sigen's Patent Infringement Complaint to ITC
Dec 11, 2015Soitec of Bernin, near Grenoble, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers, says that it is defending its rights in an investigation by the US International Trade Commission (ITC) instituted on 18 ...
Tags: Soitec, SOI, Engineered substrates
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Soitec Announces a Definitive Agreement to Sell Its Solar System Business
May 28, 2015Soitec of Bernin, near Grenoble, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers, has announced a definitive agreement to sell its solar system business - including all technology assets and ...
Tags: Soitec, Core Semiconductor
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EVG Introduced Two Configurations to Its Evg580 Combond System Configurations
Mar 17, 2015EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has introduced two new configurations to its EVG580 ComBond series of automated ...
Tags: EV Group, wafer bonding systems
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a Multi-Junction Solar Cell Has Been Developed
Dec 3, 2014Bernin-based Soitec (which makes engineered substrates and CPV systems) and Grenoble-based micro/nanotechnology R&D center CEA-Leti of France, together with the Fraunhofer Institute for Solar Energy Systems ISE of Freiburg, Germany, have ...
Tags: Solar Cell, Electrical
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Sale of Gaas Epitaxy Business of Its Soitec Specialty Electronics Subsidiary to IntelliEPI
Sep 30, 2014Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, has announced the sale of the gallium arsenide (GaAs) epitaxy business of its Soitec Specialty Electronics ...
Tags: sale of GaAs, IntelliEPI, Electronics
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New Contract Aims to Support Soitec's Strategy for The Electronics,Solar Energy
Dec 23, 2013This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets. It will focus on engineered substrates and materials offering higher performances and energy savings at a competitive cost. As the ...
Tags: Lights, Lighting, Electronics
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Engineers at Imec and IBM Have Independently Developed New Manufacturing Processes
Dec 23, 2013Engineers at Imec and IBM have independently developed new manufacturing processes for making the next decade's leading chips, they revealed late last year. These efforts will allow the marriage of silicon wafers and certain exotic ...
Tags: Electrical, Electronics
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Soitec Renewed Their Long-Standing Partnership for The Next Five Years
Dec 20, 2013Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, and CEA (the French Atomic and Renewable Energy Commission) have renewed their long-standing partnership for the ...
Tags: Soitec of Bernin, Electrical
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Soitec Uses Molecular Beam Epitaxy to Manufacture Indium Phosphide
Dec 16, 2013Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, and Intelligent Epitaxy Technology Inc (IntelliEPI) of Richardson, TX, USA, which uses molecular beam epitaxy (MBE) ...
Tags: IntelliEpi, Soitec, engineered substrates, GaAs
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Soitec Entered Into a Patent Cross-License Agreement
Nov 29, 2013Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - and silicon wafer manufacturer SunEdison Inc of St. Peters, MO, USA have entered into a patent cross-license ...
Tags: Soitec SOI engineered substrates, Electrical, Electronics
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Alstom and Soitec Signed a Cooperative Agreement to Provide CPV Power Plants
Jul 31, 2013Power generation and transmission firm Alstom and Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - as well as concentrating photovoltaic (CPV) solar systems, ...
Tags: CPV Power Plants, Alstom, Soitec
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SOI Technologies Are Now Mainstream for Manufacturing Switches
Jul 12, 2013At the SEMICON West trade show in San Francisco (9-11 July), Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - as well as concentrating photovoltaic (CPV) solar ...
Tags: Electrical, Electronics
