Wafer Bonding articles & resources on Made-in-China.com

Monolithic Electrically Injected Microdisk Lasers on Silicon

Aug 1, 2017

Researchers in Russia claim “the first demonstration of an injection quantum well microdisk laser fabricated of III-V materials monolithically grown on silicon (001) substrate” [N. V. Kryzhanovskaya et al, Optics Express, vol. ...

Tags: silicon photonics, Lasers

Micro-LED-Like Displays and Projection Modules to Be Available in 2018

Jul 24, 2017

A major bottleneck in the commercialization of micro-LED displays is the mass transfer of micron-size LEDs to a display backplane, according to ‘3Q17 Micro LED Next Generation Display Industry Member Report: Analyses on Mass Transfer ...

Tags: micro-LED, displays

EVG Earns Fifth Consecutive Triple Win in Vlsiresearch Annual Customer Satisfaction Survey

Jul 5, 2017

For the fifth consecutive year, EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – has earned all ...

Tags: EV Group, Chip Making Equipment

Multi-Junction Si Solar Cell Efficiency Exceeds

Nov 12, 2016

Silicon-based solar cells dominates today’s solar energy industry, while this technology has difficulty in bringing the conversion efficiency beyond 23% for commercialized solar cells in mass production. In order to break the ...

Tags: Solar Cell, solar energy

Reducing Subthreshold Swing of Gallium Arsenide Transistors

Sep 28, 2016

Korea Institute of Science and Technology (KIST) claims a record low subthreshold swing of 68mV/decade for a gallium arsenide (GaAs) field-effect transistor (FET) [SangHyeon Kim et al, IEEE Electron Device Letters, published online 24 ...

Tags: KIST, GaAs, FET

Leti Orders EVG Hercules NILSystem to Bolster Process Development and Demo Capabilities of EVG-Leti Inspire Program

Sep 23, 2016

EV Group of St Florian, Austria - a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS), compound semiconductors, power devices and nanotechnology applications says that a HERCULES ...

Tags: EV Group, NIL, EVG-Leti INSPIRE

Mitsubishi Heavy Industries Machine Tool Collaborating with D-process on Room-Temperature Wafer Bonding Services

Sep 9, 2016

Mitsubishi Heavy Industries Machine Tool Co Ltd of Ritto City, Shiga, Japan (founded in October 2015), a group company of Tokyo-based machinery maker Mitsubishi Heavy Industries Ltd (MHI), has agreed with D-process Inc of Yamato, Kanagawa, ...

Tags: Mitsubishi Heavy Industries, D-process, room-temperature wafer bonding

EV Group Unveils Automated Metrology System for Advanced Packaging

Jul 19, 2016

EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG50 automated metrology system. Designed to support the increasingly stringent manufacturing ...

Tags: Advanced Packaging, EV Group

Transfer Printing of Optically Pumped III-V Device on Silicon-on-Insulator

Jun 30, 2016

Ghent University/IMEC in Belgium and X-Celeprint in Ireland/USA claim "the first III-V optoelectronic components transfer printed on and coupled to a silicon photonic integrated circuit" [Andreas De Groote et al, Optics Express, vol24, ...

Tags: III-V optoelectronic, silicon photonic

EVG Achieves Fourth Consecutive Triple Win in Vlsiresearch Customer Satisfaction Survey

Jun 23, 2016

For a fourth consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards resulting from VLSIresearch Inc's ...

Tags: EV Group, focused chip

Subwavelength Micro-Disk Lasers on Exact (001) Silicon Substrate

Jun 23, 2016

Researchers in Hong Kong and USA have been working on producing optically pumped micro-disk lasers on exact (001) silicon [Yating Wan et al, Appl. Phys. Lett., vol108, p221101, 2016]. The team from Hong Kong University of Science and ...

Tags: Subwavelength, CMOS-compatible platform

Onchip Offers Thin-Film Wafer Backside Metallization of Solderable Die-Attach Metal Stacks

Jun 20, 2016

Integrated passive device maker OnChip Devices Inc of Santa Clara, CA, USA says that its wafer fabrication facility is offering backside metallization (BSM) of thin films for applications such as military, medical, and instrumentation. ...

Tags: Sputtering, HB-LEDs, GaN-on-Si, Wafer bonding

Epitaxial Growth of Laser Diodes on Wafer-Bonded InP/Si Substrates

Jun 12, 2016

Sophia University in Japan has developed a technique for growing laser diodes on an indium phosphide (InP) layer bonded to silicon (Si) [Keiichi Matsumoto et al, Appl. Phys. Express, vol9, p062701, 2016]. The researchers claim that this is ...

Tags: Laser Diodes, Si Substrates

Direct Growth Of III-V Quantum Dot Lasers On Silicon Substrate

Mar 15, 2016

Researchers in the UK have claimed the first demonstration of laser diodes grown directly on silicon that perform up to 75°C and 120°C under continuous wave (cw) and pulsed operation, respectively [Siming Chen et al, Nature ...

Tags: Quantum dot lasers, GaAs, Silicon substrate, MBE

EVG's Executive Technology Director Paul Lindner Receives European Semi Award

Mar 13, 2016

At the SEMI Industry Strategy Symposium Europe 2016 conference in Nice, France (6–8 March), Paul Lindner, executive technology director at EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for ...

Tags: EV Group, Engineered substrates

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