MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics
Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...
Tags: LED, packaging equipment
EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) says that over the past year it has seen a significant increase in demand for its wafer bonding ...
Xerium Technologies has introduced an improved polyurethane roll cover technology Blue Diamond for press nip conditions in paper making industry. US-based Xerium supplies woven fabrics and other products used in making paper. According ...
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has introduced two new configurations to its EVG580 ComBond series of automated ...
Tags: EV Group, wafer bonding systems
Set to replace the discontinued Duofast Trimbonder line of adhesives in Chemical Concepts’ line of adhesives products is TrimGrip, an advanced Cellular PVC Adhesive now associated with the Chem-Set brand. The structural adhesive ...
Tags: Bonding System, nail holes, Construction
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has shipped an EVG510 semi-automated wafer bonding system and an EVG620 automated bond ...
Tags: EV Group, wafer bonding system
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and semiconductor applications, says that the Singapore-MIT Alliance for Research ...
Tags: EV Group Bonding, Wafer Bonding
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, says it has achieved strong revenue growth and expanded its headcount in Q1/2013. The firm attributes this to continuing demand for its flexible ...
Tags: EV Group, Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, has installed an EVG501 wafer bonding R&D system at Texas ...
Tags: EVG, Wafer, bonding system, lithography
Two Sonobond machines — a SpliceRite™ Ultrasonic Wire Splicer and a SonoWeld® 1600 Ultrasonic Metal Spot Welder — remained operational after a devastating storm demolished the production area of SolaHD's Rainsville, AL ...
10 October 2012 Shenyang Silicon Technology opts for EV Group's EVG850LT 300-mm SOI production bonding system EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography equipment,says that China-U.S.joint-venture ...
Tags: Shenyang Silicon Technology, EVG850LT 300-mm SOI, Austria, SOI wafers
Teknor Apex, one of the world's largest compounders of flexible PVC, is actively developing a PVC-free alternative for medical applications and already reports a handful of commercial applications in smaller sizes. Replacing PVC in medical ...
Tags: market view