Stora Enso has collaborated with Microsoft to provide cloud-based intelligent packaging solutions for the global clients. Stora Enso’s intelligent packaging will use Microsoft Azure, a cloud platform for business digitalization. ...
Tags: Stora Enso, Packaging
UK-based Global Inkjet Systems (GIS) is set to exhibit its latest product solutions for complex industrial applications in functional and decorative printing at this year’s InPrint show in Germany. The event will take place between ...
Tags: GIS, Decorative Printing
Xeikon is set to exhibit a range of digital printing solutions for the graphic arts, label and packaging industries at this year’s IPEX event in the UK. The event will take place between 31 October and 3 November in Birmingham. ...
Tags: Xeikon, Digital Printing
India-based Creative Graphics has invested in Esko’s platforms, in a bid to enhance its production operations. India’s largest packaging prepress and flexographic plate provider has expanded in the past three years with its ...
Tags: Creative Graphics, packaging
Germany-based Multivac Marking & Inspection has introduced a new generation of direct web printer, DP 230, for integration in compact thermoforming packaging machines. The new space-saving and hygienic direct web printer is designed for ...
Tags: web printer, packaging
GaN Systems Inc of Ottawa, Ontario, Canada – a fabless developer of gallium nitride (GaN)-based power switching semiconductors for power conversion and control applications – has made available the GS61004B-EVBDC evaluation ...
Tags: GaN Systems, integrated circuits
Japanese automaker Toyota will be showcasing its new Concept-i series at Tokyo Motor Show 2017, which will be held from 25 October through 5 November. The Concept-i series includes two vehicles, the Concept-i and Concept-i RIDE. These two ...
Tags: Toyota, Tokyo Motor Show 2017
Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has launched the UltraCMOS PE29102 high-speed FET driver. With a ...
GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with more than 250 customers and operations in Singapore, Germany and the USA) has announced its vision and roadmap for a range of technology ...
Tags: semiconductor, wireless networks
Plastic packaging designer and manufacturer Placon has introduced new four-compartment GoCube base for grab and go snack products. The new 24-ounce base is part of the firm’s Fresh n’ Clear GoCubes stock food packaging line, ...
US-based NutraFuels (NTFU) has installed a high speed filling and packaging equipment at its manufacturing facility to produce dietary supplement nutritional products. The firm will commission the new filling and sealing machine at its ...
Tags: NutraFuels, Packaging Equipment
Technology company Continental has developed a central input device to further advance the development of automated driving. The Smart Control input device informs vehicle occupants if automated driving or manual driving is possible and ...
Tags: Continental, Automated Driving
Multivac Marking & Inspection has introduced a new thermal transfer printer designed for narrow print widths in a range of applications. The network-enabled thermal transfer printer, TTO 06, has a print resolution of 300 dpi and can print ...
Tags: thermal transfer printer, printer
Valmet will supply a Valmet Brown Stock quality analyzer (Valmet Kappa Q1) for CMPC Celulosa in Santa Fe, Chile for its fiber line 1 producing ECF (Elemental Chlorine Free) bleached eucalyptus pulp. To be installed in the blow line of the ...
AstroNova’s TrojanLabel and QuickLabel units will unveil four new label presses and printers at Pack Expo 2017 and Labelexpo Europe 2017. The company will showcase its QuickLabel QL-30 and QL-60, compact, monochrome high-speed ...
Tags: Label Presse, Printers