Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers (as well as III-V epiwafers through its Picogiga International division), has more than doubled production of bonded silicon-on-sapphire ...
Tags: RF, CMOS, Silicon On Sapphire, UltraCMOS, RFIC
10 October 2012 Shenyang Silicon Technology opts for EV Group's EVG850LT 300-mm SOI production bonding system EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography equipment,says that China-U.S.joint-venture ...
Tags: Shenyang Silicon Technology, EVG850LT 300-mm SOI, Austria, SOI wafers
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services. As part of the company's long-term growth ...
Tags: EV Group, R&D facilities, wafer bonding equipment, lithography equipment
EV Group (EVG) a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in ...
Tags: EV Group, light emitting diodes, LEDs
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, has completed its newly expanded cleanroom IV facility. ...
Tags: EVG, MEMS, semiconductor
Many researchers have reported improvements in LED technology by enhancing the properties of the LED itself. But the packaging that secures and protects the LED also impacts its overall performance. In a new study, researchers from Taiwan ...
Tags: led package
By blending optical technology with low-cost CMOS semiconductor processing,silicon photonics has tremendous potential as a new technology,according to market research firm Yole Développement in its new report'Silicon Photonics ...
Tags: silicon photonics, CMOS, AOCs, 3D
EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography equipment for the MEMS(micro-electro-mechanical system),nanotechnology and semiconductor markets,has received an order for its EVG850 temporary ...
4 September 2012 EV Group launches next-generation EVG150 automated resist processing platform for compound semiconductors,MEMS,and advanced packaging EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography ...
Tags: EV Group, MEMS, spray coating technology
24 May 2012 EVG jumps from 15th to 4th in VLSIresearch’s ranking of chip-making equipment suppliers EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical ...
Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST, " capable of producing 3-dimensionally integrated LSI (large-scale ...
Tags: industry trends, bonding machine
Eulitha AG of Villigen, Switzerland, a producer of nanostructures using advanced lithography techniques, announced that it has signed a joint-development and licensing agreement with EV Group (EVG), a supplier of wafer bonding and ...
Tags: led
EV Group has announced a joint development agreement with Eulitha AG, whereby the companies will combine their expertise in nanolithography to develop a full-field exposure tool for patterning sapphire substrates. EV Group (EVG), a supplier ...
Tags: Market View, led