Epistar recently was granted its 1000th patent. This number will continue to grow as there are about another 1,000 applications pending worldwide. Since its establishment in 1996, Epistar has firmly believed that technology innovation is ...
Tags: Epistar, LED Patent
With gold, copper or tin and special galvanizing processes, scientists are improving the function of semi-conductors and making the manufacture of microelectronic systems a child‘s play. Especially the LED industry could profit from ...
Tags: LED Chip
Formosa Epitaxy,a Taiwan-based LED epitaxial wafer and chip maker,Crystalwise Technology(CWT)and Crystal Applied Technology(CAT),two Taiwan-based sapphire wafer makers,saw November revenues drop by 22.96%,9.32%and rise by 5.00%on month ...
Tags: Formosa Epitaxy, LED epitaxial wafer and chip, CWT, CAT
Due to the global economic downturn, demand for LED lighting has been weakening. Meanwhile, efficiency and price-performance ratio have been increasing, and the penetration rate of the LED lighting market is expected to continue rising. ...
Tags: Bridgelux, LED chipmaker, LED lighting, efficiency, price-performance
Valspar Sourcing, Inc. has been granted a parent for an article comprised of a body portion or end portion of a food or beverage can comprised of a metal substrate. The food or beverage can coating composition is disposed on an inside ...
Tags: Valspar Sourcing, parent, body portion, end portion, food can, beverage can
SDC Coatings, Inc. has been awarded a patent for a process for tinting a transparent, tintable, abrasion-resistant coating that is coated on at least one surface of a substrate, comprised of applying a polyurethane dispersion-based primer ...
Tags: SDC Coatings, patent, tinting a transparent, abrasion-resistant coating
US-based EFI has incorporated a new 720dpi mode to increase the print resolution for labels, along with broadening its portfolio of flexo substrates that require no special coating or overlaminating. The increased print resolution uses ...
Tags: Labels, Print Resolution, firing modes
Mexican packaging company Grupo Gondi has invested in Bobst F&K 90SIX CI preprint flexo press and peripherals from Bobst Bielefeld, which will be used for preprinted linerboard and coated boxboard applications. According to Bobst, the 2.2 ...
Tags: packaging, Grupo Gondi, flexo press
Researchers based in France and Germany have developed techniques for growing indium arsenide (InAs) channel structures on silicon [L. Desplanque et al, Appl. Phys. Lett., vol101, p142111, 2012]. Room-temperature mobility for the epitaxial ...
Tags: growing indium arsenide, InAs, chemicals
Researchers from Japan and the USA have reported the first fabrication on hydride vapor phase epitaxy (HVPE) aluminium nitride (AlN) substrates of aluminium gallium nitride (AlGaN) light-emitting diodes (LEDs) that emit at the ...
Tags: DUV, LEDs, AlGaN, AlN substrates, HVPE, light-emitting diodes
Singapore researchers have developed high-mobility III-V indium gallium arsenide (InGaAs) channel n-type metal-oxide-semiconductor field-effect transistors (n-MOSFET) on germanium-on-insulator (GeOI) substrates [Ivana et al, Appl. Phys. ...
Tags: n-MOSFETs, metal-oxide-semiconductor, semiconductor, transistors
Ascent Solar Technologies Inc of Thornton, CO, USA, which manufactures lightweight thin-film photovoltaic modules based on copper indium gallium diselenide (CIGS) using flexible substrate materials, has introduced the EnerPlex Kickr IV, a ...
Tags: Ascent Solar, solar charger, phone's battery
Until the end of January 2013, Osram shows its OLED installation "Dandelion" in the BMW museum in Munich, Germany. The installation consists of about 1,000 organic light-emitting diodes, so-called OLEDs. Like its sibling the LED, an OLED ...
Tags: Osram, Feature Lighting, OLED, BMW museum
ITRI announced its cutting edge roll-to-roll (R2R) process on 100µm flexible glass substrates today at FPD International, an industry trade show, occurring Oct. 31 - Nov. 2, 2012 in Yokohama, Japan. Drawing inspiration from the R2R ...
Tags: ITRI, R2R process, flexible glass substrates
Germany-based CGS Publishing Technologies will unveil the packaging tool RealVue 3D Packager for packaging design and visualization at Drupa in Düsseldorf during 3-16 May 2012. Working with DXF, PDF, and Adobe Illustrator (AI) files, ...
Tags: 3d Packager, packaging design, flexible packaging proofs